Datasheet

26
32142DS–06/2013
ATUC64/128/256L3/4U
Figure 4-5. QFN-64 Package Drawing
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 4-14. Device and Package Maximum Weight
200 mg
Table 4-15. Package Characteristics
Moisture Sensitivity Level MSL3
Table 4-16. Package Reference
JEDEC Drawing Reference M0-220
JESD97 Classification E3