Datasheet

16
8183FS–AVR–06/12
ATtiny24A/44A/84A
7.3 15CC1
TITLE
DRAWING NO.GPC
REV.
Package Drawing Contact:
[e-mail]
R
C
CBC
15CC1, 15-ball (4 x 4 Array), 3.0 x 3.0 x 0.6 mm
package, ball pitch 0.65 mm,
Ultra thin, Fine-Pitch Ball Grid Array Package (UFBGA)
15CC1
07/06/10
A – – 0.60
A1 0.12 – –
A2 0.38 REF
b 0.25 0.30 0.35 1
b1 0.25 – – 2
D 2.90 3.00 3.10
D1 1.95 BSC
E 2.90 3.00 3.10
E1 1.95 BSC
e 0.65 BSC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
TOP VIEW
123 4
A
B
C
D
E
D
15-Øb
D
C
B
A
Pin#1 ID
0.08
A1
A
D1
E1
A2
A1 BALL CORNER
e
123 4
SIDE VIEW
b1
BOTTOM VIEW
e
Note1:
Dimension “b” is measured at the maximum ball dia. in a plane parallel
to the seating plane.
Note2:
Dimension “b1” is the solderable surface defined by the opening of the
solder resist layer.