Datasheet
Table Of Contents
- Features
- 1. Pin Configurations
- 2. Overview
- 3. About
- 4. CPU Core
- 5. Memories
- 6. Clock System
- 7. Power Management and Sleep Modes
- 8. System Control and Reset
- 9. Interrupts
- 10. I/O Ports
- 11. 8-bit Timer/Counter0 with PWM
- 11.1 Features
- 11.2 Overview
- 11.3 Clock Sources
- 11.4 Counter Unit
- 11.5 Output Compare Unit
- 11.6 Compare Match Output Unit
- 11.7 Modes of Operation
- 11.8 Timer/Counter Timing Diagrams
- 11.9 Register Description
- 11.9.1 TCCR0A – Timer/Counter Control Register A
- 11.9.2 TCCR0B – Timer/Counter Control Register B
- 11.9.3 TCNT0 – Timer/Counter Register
- 11.9.4 OCR0A – Output Compare Register A
- 11.9.5 OCR0B – Output Compare Register B
- 11.9.6 TIMSK0 – Timer/Counter 0 Interrupt Mask Register
- 11.9.7 TIFR0 – Timer/Counter 0 Interrupt Flag Register
- 12. 16-bit Timer/Counter1
- 12.1 Features
- 12.2 Overview
- 12.3 Timer/Counter Clock Sources
- 12.4 Counter Unit
- 12.5 Input Capture Unit
- 12.6 Output Compare Units
- 12.7 Compare Match Output Unit
- 12.8 Modes of Operation
- 12.9 Timer/Counter Timing Diagrams
- 12.10 Accessing 16-bit Registers
- 12.11 Register Description
- 12.11.1 TCCR1A – Timer/Counter1 Control Register A
- 12.11.2 TCCR1B – Timer/Counter1 Control Register B
- 12.11.3 TCCR1C – Timer/Counter1 Control Register C
- 12.11.4 TCNT1H and TCNT1L – Timer/Counter1
- 12.11.5 OCR1AH and OCR1AL – Output Compare Register 1 A
- 12.11.6 OCR1BH and OCR1BL – Output Compare Register 1 B
- 12.11.7 ICR1H and ICR1L – Input Capture Register 1
- 12.11.8 TIMSK1 – Timer/Counter Interrupt Mask Register 1
- 12.11.9 TIFR1 – Timer/Counter Interrupt Flag Register 1
- 13. Timer/Counter Prescaler
- 14. USI – Universal Serial Interface
- 15. Analog Comparator
- 16. Analog to Digital Converter
- 16.1 Features
- 16.2 Overview
- 16.3 Operation
- 16.4 Starting a Conversion
- 16.5 Prescaling and Conversion Timing
- 16.6 Changing Channel or Reference Selection
- 16.7 ADC Noise Canceler
- 16.8 Analog Input Circuitry
- 16.9 Noise Canceling Techniques
- 16.10 ADC Accuracy Definitions
- 16.11 ADC Conversion Result
- 16.12 Temperature Measurement
- 16.13 Register Description
- 17. debugWIRE On-chip Debug System
- 18. Self-Programming the Flash
- 18.1 Performing Page Erase by SPM
- 18.2 Filling the Temporary Buffer (Page Loading)
- 18.3 Performing a Page Write
- 18.4 Addressing the Flash During Self-Programming
- 18.5 EEPROM Write Prevents Writing to SPMCSR
- 18.6 Reading Lock, Fuse and Signature Data from Software
- 18.7 Preventing Flash Corruption
- 18.8 Programming Time for Flash when Using SPM
- 18.9 Register Description
- 19. Memory Programming
- 19.1 Program And Data Memory Lock Bits
- 19.2 Fuse Bytes
- 19.3 Device Signature Imprint Table
- 19.4 Page Size
- 19.5 Serial Programming
- 19.6 High-voltage Serial Programming
- 19.7 High-Voltage Serial Programming Algorithm
- 19.7.1 Enter High-voltage Serial Programming Mode
- 19.7.2 Considerations for Efficient Programming
- 19.7.3 Chip Erase
- 19.7.4 Programming the Flash
- 19.7.5 Programming the EEPROM
- 19.7.6 Reading the Flash
- 19.7.7 Reading the EEPROM
- 19.7.8 Programming and Reading the Fuse and Lock Bits
- 19.7.9 Reading the Signature Bytes and Calibration Byte
- 19.7.10 Power-off sequence
- 20. Electrical Characteristics
- 21. Typical Characteristics
- 21.1 Supply Current of I/O Modules
- 21.2 Active Supply Current
- 21.3 Idle Supply Current
- 21.4 Power-down Supply Current
- 21.5 Standby Supply Current
- 21.6 Pin Pull-up
- 21.7 Pin Driver Strength
- 21.8 Pin Threshold and Hysteresis
- 21.9 BOD Threshold and Analog Comparator Offset
- 21.10 Internal Oscillator Speed
- 21.11 Current Consumption of Peripheral Units
- 21.12 Current Consumption in Reset and Reset Pulsewidth
- 22. Register Summary
- 23. Instruction Set Summary
- 24. Ordering Information
- 25. Packaging Information
- 26. Errata
- 27. Datasheet Revision History
- Table of Contents
175
8006K–AVR–10/10
ATtiny24/44/84
Notes: 1. Typical values at +25°C.
2. “Min” means the lowest value where the pin is guaranteed to be read as high.
3. “Max” means the highest value where the pin is guaranteed to be read as low.
4. Although each I/O port can sink more than the test conditions (10 mA at V
CC
= 5V, 5 mA at V
CC
= 3V) under steady state
conditions (non-transient), the sum of all I
OL
(for all ports) should not exceed 60 mA. If I
OL
exceeds the test conditions, V
OL
may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition.
5. Although each I/O port can source more than the test conditions (10 mA at V
CC
= 5V, 5 mA at V
CC
= 3V) under steady state
conditions (non-transient), the sum of all I
OH
(for all ports) should not exceed 60 mA. If I
OH
exceeds the test condition, V
OH
may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition.
6. The RESET pin must tolerate high voltages when entering and operating in programming modes and, as a consequence,
has a weak drive strength as compared to regular I/O pins. See Figure 21-24, Figure 21-25, Figure 21-26, and Figure 21-27
(starting on page 198).
7. Values are with external clock using methods described in “Minimizing Power Consumption” on page 35. Power Reduction is
enabled (PRR = 0xFF) and there is no I/O drive.
8. BOD Disabled.
20.3 Speed
The maximum operating frequency of the device depends on V
CC.
As shown in Figure 20-1 and
Figure 20-2, the maximum frequency vs. V
CC
relationship is linear between 1.8V < V
CC
< 2.7V
and between 2.7V < V
CC
< 4.5V.
Figure 20-1. Maximum Frequency vs. V
CC
(ATtiny24V/44V/84V)
I
CC
Power Supply Current
(7)
Active 1MHz, V
CC
= 2V 0.33 0.8 mA
Active 4MHz, V
CC
= 3V 1.6 2.5 mA
Active 8MHz, V
CC
= 5V 5 9 mA
Idle 1MHz, V
CC
= 2V 0.11 0.4 mA
Idle 4MHz, V
CC
= 3V 0.4 1.0 mA
Idle 8MHz, V
CC
= 5V 1.5 3.5 mA
Power-down mode
(8)
WDT enabled, V
CC
= 3V 4.5 10 µA
WDT disabled, V
CC
= 3V 0.15 2 µA
Table 20-1. DC Characteristics. T
A
= -40°C to +85°C (Continued)
Symbol Parameter Condition Min Typ
(1)
Max Units
10 MHz
4 MHz
1.8V 2.7V 5.5V
Safe Operating Area