Datasheet
Table Of Contents
- Features
- 1. Pin Configurations
- 2. Overview
- 3. About
- 4. CPU Core
- 5. Memories
- 6. Clock System
- 7. Power Management and Sleep Modes
- 8. System Control and Reset
- 9. Interrupts
- 10. I/O Ports
- 11. 8-bit Timer/Counter0 with PWM
- 11.1 Features
- 11.2 Overview
- 11.3 Clock Sources
- 11.4 Counter Unit
- 11.5 Output Compare Unit
- 11.6 Compare Match Output Unit
- 11.7 Modes of Operation
- 11.8 Timer/Counter Timing Diagrams
- 11.9 Register Description
- 11.9.1 TCCR0A – Timer/Counter Control Register A
- 11.9.2 TCCR0B – Timer/Counter Control Register B
- 11.9.3 TCNT0 – Timer/Counter Register
- 11.9.4 OCR0A – Output Compare Register A
- 11.9.5 OCR0B – Output Compare Register B
- 11.9.6 TIMSK0 – Timer/Counter 0 Interrupt Mask Register
- 11.9.7 TIFR0 – Timer/Counter 0 Interrupt Flag Register
- 12. 16-bit Timer/Counter1
- 12.1 Features
- 12.2 Overview
- 12.3 Timer/Counter Clock Sources
- 12.4 Counter Unit
- 12.5 Input Capture Unit
- 12.6 Output Compare Units
- 12.7 Compare Match Output Unit
- 12.8 Modes of Operation
- 12.9 Timer/Counter Timing Diagrams
- 12.10 Accessing 16-bit Registers
- 12.11 Register Description
- 12.11.1 TCCR1A – Timer/Counter1 Control Register A
- 12.11.2 TCCR1B – Timer/Counter1 Control Register B
- 12.11.3 TCCR1C – Timer/Counter1 Control Register C
- 12.11.4 TCNT1H and TCNT1L – Timer/Counter1
- 12.11.5 OCR1AH and OCR1AL – Output Compare Register 1 A
- 12.11.6 OCR1BH and OCR1BL – Output Compare Register 1 B
- 12.11.7 ICR1H and ICR1L – Input Capture Register 1
- 12.11.8 TIMSK1 – Timer/Counter Interrupt Mask Register 1
- 12.11.9 TIFR1 – Timer/Counter Interrupt Flag Register 1
- 13. Timer/Counter Prescaler
- 14. USI – Universal Serial Interface
- 15. Analog Comparator
- 16. Analog to Digital Converter
- 16.1 Features
- 16.2 Overview
- 16.3 Operation
- 16.4 Starting a Conversion
- 16.5 Prescaling and Conversion Timing
- 16.6 Changing Channel or Reference Selection
- 16.7 ADC Noise Canceler
- 16.8 Analog Input Circuitry
- 16.9 Noise Canceling Techniques
- 16.10 ADC Accuracy Definitions
- 16.11 ADC Conversion Result
- 16.12 Temperature Measurement
- 16.13 Register Description
- 17. debugWIRE On-chip Debug System
- 18. Self-Programming the Flash
- 18.1 Performing Page Erase by SPM
- 18.2 Filling the Temporary Buffer (Page Loading)
- 18.3 Performing a Page Write
- 18.4 Addressing the Flash During Self-Programming
- 18.5 EEPROM Write Prevents Writing to SPMCSR
- 18.6 Reading Lock, Fuse and Signature Data from Software
- 18.7 Preventing Flash Corruption
- 18.8 Programming Time for Flash when Using SPM
- 18.9 Register Description
- 19. Memory Programming
- 19.1 Program And Data Memory Lock Bits
- 19.2 Fuse Bytes
- 19.3 Device Signature Imprint Table
- 19.4 Page Size
- 19.5 Serial Programming
- 19.6 High-voltage Serial Programming
- 19.7 High-Voltage Serial Programming Algorithm
- 19.7.1 Enter High-voltage Serial Programming Mode
- 19.7.2 Considerations for Efficient Programming
- 19.7.3 Chip Erase
- 19.7.4 Programming the Flash
- 19.7.5 Programming the EEPROM
- 19.7.6 Reading the Flash
- 19.7.7 Reading the EEPROM
- 19.7.8 Programming and Reading the Fuse and Lock Bits
- 19.7.9 Reading the Signature Bytes and Calibration Byte
- 19.7.10 Power-off sequence
- 20. Electrical Characteristics
- 21. Typical Characteristics
- 21.1 Supply Current of I/O Modules
- 21.2 Active Supply Current
- 21.3 Idle Supply Current
- 21.4 Power-down Supply Current
- 21.5 Standby Supply Current
- 21.6 Pin Pull-up
- 21.7 Pin Driver Strength
- 21.8 Pin Threshold and Hysteresis
- 21.9 BOD Threshold and Analog Comparator Offset
- 21.10 Internal Oscillator Speed
- 21.11 Current Consumption of Peripheral Units
- 21.12 Current Consumption in Reset and Reset Pulsewidth
- 22. Register Summary
- 23. Instruction Set Summary
- 24. Ordering Information
- 25. Packaging Information
- 26. Errata
- 27. Datasheet Revision History
- Table of Contents
174
8006K–AVR–10/10
ATtiny24/44/84
20. Electrical Characteristics
20.1 Absolute Maximum Ratings*
20.2 DC Characteristics
Operating Temperature.................................. -55°C to +125°C
*NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
age to the device. This is a stress rating only and
functional operation of the device at these or
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Storage Temperature ..................................... -65°C to +150°C
Voltage on any Pin except RESET
with respect to Ground ................................-0.5V to V
CC
+0.5V
Voltage on RESET
with respect to Ground......-0.5V to +13.0V
Maximum Operating Voltage ............................................ 6.0V
DC Current per I/O Pin ............................................... 40.0 mA
DC Current V
CC
and GND Pins ................................ 200.0 mA
Table 20-1. DC Characteristics. T
A
= -40°C to +85°C
Symbol Parameter Condition Min Typ
(1)
Max Units
V
IL
Input Low Voltage
V
CC
= 1.8 - 2.4V
V
CC
= 2.4 - 5.5V
-0.5
0.2V
CC
(3)
0.3V
CC
(3)
V
V
IH
Input High-voltage
Except RESET pin
V
CC
= 1.8 - 2.4V
V
CC
= 2.4 - 5.5V
0.7V
CC
(2)
0.6V
CC
(2)
V
CC
+0.5 V
V
IH1
Input High-voltage
RESET pin
V
CC
= 1.8V to 5.5V 0.9V
CC
(2)
V
CC
+0.5 V
V
OL
Output Low Voltage
(4)
Except RESET pin
(6)
I
OL
= 10 mA, V
CC
= 5V
I
OL
= 5 mA, V
CC
= 3V
0.6
0.5
V
V
V
OH
Output High-voltage
(5)
Except RESET pin
(6)
I
OH
= -10 mA, V
CC
= 5V
I
OH
= -5 mA, V
CC
= 3V
4.3
2.5
V
V
I
LIL
Input Leakage
Current I/O Pin
V
CC
= 5.5V, pin low
(absolute value)
< 0.05 1 µA
I
LIH
Input Leakage
Current I/O Pin
V
CC
= 5.5V, pin high
(absolute value)
< 0.05 1 µA
R
RST
Reset Pull-up Resistor V
CC
= 5.5V, input low 30 60 kΩ
R
PU
I/O Pin Pull-up Resistor V
CC
= 5.5V, input low 20 50 kΩ