Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsDev KitsPCB design board

581

582

583

584

585

586

587

588

589

590

Table Of Contents

Description
Features
1. Configuration Summary
2. Ordering Information
- 2.1 SAM D20E
- 2.2 SAM D20G
- 2.3 SAM D20J
3. Block Diagram
4. Pinout
- 4.1 SAM D20J
- 4.2 SAM D20G
- 4.3 SAM D20E
5. I/O Multiplexing and Considerations
- 5.1 Multiplexed Signals
- 5.2 Other Functions
  - 5.2.1 Oscillator Pinout
  - 5.2.2 Serial Wire Debug Interface Pinout
6. Signal Descriptions List
7. Power Supply and Start-Up Considerations
- 7.1 Power Domain Overview
- 7.2 Power Supply Considerations
- 7.3 Power-Up
- 7.4 Power-On Reset and Brown-Out Detector
8. Product Mapping
9. Memories
- 9.1 Embedded Memories
- 9.2 Physical Memory Map
- 9.3 Non-Volatile Memory (NVM) User Row Mapping
- 9.4 NVM Software Calibration Area Mapping
- 9.5 Serial Number
10. Processor and Architecture
- 10.1 Cortex-M0+ Processor
- 10.2 Nested Vector Interrupt Controller
  - 10.2.1 Overview
  - 10.2.2 Interrupt Line Mapping
- 10.3 High-Speed Bus Matrix
  - 10.3.1 Features
  - 10.3.2 Configuration
- 10.4 AHB-APB Bridge
- 10.5 PAC – Peripheral Access Controller
  - 10.5.1 Overview
- 10.6 Register Description
11. Peripherals Configuration Overview
12. DSU – Device Service Unit
- 12.1 Overview
- 12.2 Features
- 12.3 Block Diagram
- 12.4 Signal Description
- 12.5 Product Dependencies
- 12.6 Debug Operation
- 12.7 Chip-Erase
- 12.8 Programming
- 12.9 Intellectual Property Protection
- 12.10 Device Identification
  - 12.10.1 CoreSight Identification
  - 12.10.2 DSU Chip Identification Method:
- 12.11 Functional Description
- 12.12 Register Summary
- 12.13 Register Description
13. Clock System
- 13.1 Clock Distribution
- 13.2 Synchronous and Asynchronous Clocks
- 13.3 Register Synchronization
- 13.4 Enabling a Peripheral
- 13.5 On-demand, Clock Requests
- 13.6 Power Consumption vs Speed
- 13.7 Clocks after Reset
14. GCLK – Generic Clock Controller
- 14.1 Overview
- 14.2 Features
- 14.3 Block Diagram
- 14.4 Signal Description
- 14.5 Product Dependencies
- 14.6 Functional Description
- 14.7 Register Summary
- 14.8 Register Description
15. PM – Power Manager
- 15.1 Overview
- 15.2 Features
- 15.3 Block Diagram
- 15.4 Signal Description
- 15.5 Product Dependencies
- 15.6 Functional Description
- 15.7 Register Summary
- 15.8 Register Description
16. SYSCTRL – System Controller
- 16.1 Overview
- 16.2 Features
- 16.3 Block Diagram
- 16.4 Signal Description
- 16.5 Product Dependencies
- 16.6 Functional Description
- 16.7 Register Summary
- 16.8 Register Description
17. WDT – Watchdog Timer
- 17.1 Overview
- 17.2 Features
- 17.3 Block Diagram
- 17.4 Signal Description
- 17.5 Product Dependencies
- 17.6 Functional Description
- 17.7 Register Summary
- 17.8 Register Description
18. RTC – Real-Time Counter
- 18.1 Overview
- 18.2 Features
- 18.3 Block Diagram
- 18.4 Signal Description
- 18.5 Product Dependencies
- 18.6 Functional Description
- 18.7 Register Summary
- 18.8 Register Description
19. EIC – External Interrupt Controller
- 19.1 Overview
- 19.2 Features
- 19.3 Block Diagram
- 19.4 Signal Description
- 19.5 Product Dependencies
- 19.6 Functional Description
- 19.7 Register Summary
- 19.8 Register Description
20. NVMCTRL – Non-Volatile Memory Controller
- 20.1 Overview
- 20.2 Features
- 20.3 Block Diagram
- 20.4 Signal Description
- 20.5 Product Dependencies
- 20.6 Functional Description
- 20.7 Register Summary
- 20.8 Register Description
21. PORT
- 21.1 Overview
- 21.2 Features
- 21.3 Block Diagram
- 21.4 Signal Description
- 21.5 Product Dependencies
- 21.6 Functional Description
- 21.7 Register Summary
- 21.8 Register Description
22. EVSYS – Event System
- 22.1 Overview
- 22.2 Features
- 22.3 Block Diagram
- 22.4 Signal Description
- 22.5 Product Dependencies
- 22.6 Functional Description
- 22.7 Register Summary
- 22.8 Register Description
23. SERCOM – Serial Communication Interface
- 23.1 Overview
- 23.2 Features
- 23.3 Block Diagram
- 23.4 Signal Description
- 23.5 Product Dependencies
- 23.6 Functional Description
24. SERCOM USART – SERCOM Universal Synchronous and Asynchronous Receiver and Transmitter
- 24.1 Overview
- 24.2 Features
- 24.3 Block Diagram
- 24.4 Signal Description
- 24.5 Product Dependencies
- 24.6 Functional Description
- 24.7 Register Summary
- 24.8 Register Description
25. SERCOM SPI – SERCOM Serial Peripheral Interface
- 25.1 Overview
- 25.2 Features
- 25.3 Block Diagram
- 25.4 Signal Description
- 25.5 Product Dependencies
- 25.6 Functional Description
- 25.7 Register Summary
- 25.8 Register Description
26. SERCOM I2C – SERCOM Inter-Integrated Circuit
- 26.1 Overview
- 26.2 Features
- 26.3 Block Diagram
- 26.4 Signal Description
- 26.5 Product Dependencies
- 26.6 Functional Description
- 26.7 Register Summary
- 26.8 Register Description
  - 26.8.1 I2C Slave Register Description
  - 26.8.2 I2C Master Register Description
27. TC – Timer/Counter
- 27.1 Overview
- 27.2 Features
- 27.3 Block Diagram
- 27.4 Signal Description
- 27.5 Product Dependencies
- 27.6 Functional Description
- 27.7 Register Summary
- 27.8 Register Description
28. ADC – Analog-to-Digital Converter
- 28.1 Overview
- 28.2 Features
- 28.3 Block Diagram
- 28.4 Signal Description
- 28.5 Product Dependencies
- 28.6 Functional Description
- 28.7 Register Summary
- 28.8 Register Description
29. AC – Analog Comparators
- 29.1 Overview
- 29.2 Features
- 29.3 Block Diagram
- 29.4 Signal Description
- 29.5 Product Dependencies
- 29.6 Functional Description
- 29.7 Additional Features
- 29.8 Register Summary
- 29.9 Register Description
30. DAC – Digital-to-Analog Converter
- 30.1 Overview
- 30.2 Features
- 30.3 Block Diagram
- 30.4 Signal Description
- 30.5 Product Dependencies
- 30.6 Functional Description
- 30.7 Register Summary
- 30.8 Register Description
31. PTC - Peripheral Touch Controller
- 31.1 Overview
- 31.2 Features
- 31.3 Block Diagram
- 31.4 Signal Description
- 31.5 Product Dependencies
  - 31.5.1 I/O Lines
  - 31.5.2 Clocks
- 31.6 Functional Description
32. Electrical Characteristics
- 32.1 Disclaimer
- 32.2 Absolute Maximum Ratings
- 32.3 General Operating Ratings
- 32.4 Supply Characteristics
- 32.5 Maximum Clock Frequencies
- 32.6 Power Consumption
- 32.7 I/O Pin Characteristics
- 32.8 Analog Characteristics
- 32.9 NVM Characteristics
- 32.10 Oscillators Characteristics
- 32.11 PTC Typical Characteristics
- 32.12 Timing Characteristics
33. Packaging Information
- 33.1 Thermal Considerations
  - 33.1.1 Thermal Resistance Data
  - 33.1.2 Junction Temperature
- 33.2 Package Drawings
- 33.3 Soldering Profile
34. Schematic Checklist
- 34.1 Introduction
- 34.2 Power Supply
  - 34.2.1 Power Supply Connections
- 34.3 External Analog Reference Connections
- 34.4 External Reset Circuit
- 34.5 Unused or Unconnected Pins
- 34.6 Clocks and Crystal Oscillators
- 34.7 Programming and Debug Ports
35. Errata
- 35.1 Revision D
- 35.2 Revision C
- 35.3 Revision B
- 35.4 Revision A
36. Datasheet Revision History
- 36.1 Rev. K – 05/2014
- 36.2 Rev. J – 12/2013
- 36.3 Rev. I – 12/2013
- 36.4 Rev. H – 10/2013
- 36.5 Rev. G – 10/2013
- 36.6 Rev. F – 10/2013
- 36.7 Rev. E – 09/2013
- 36.8 Rev. D – 08/2013
- 36.9 Rev. C – 07/2013
- 36.10 Rev. B – 07/2013
- 36.11 Rev. A – 06/2013
Appendix A. Conventions
- A.1 Numerical Notation
- A.2 Memory Size and Type
- A.3 Frequency and Time
- A.4 Registers and Bits
Appendix B. Acronyms and Abbreviations
Table of Contents

581

Atmel | SMART SAM D20 [DATASHEET]

Atmel-42129K–SAM-D20_datasheet–06/2014

32.8.8 Temperature Sensor Characteristics

32.8.8.1 Temperature Sensor Characteristics

Table 32-27. Temperature Sensor Characteristics

(1))

Note: 1. These values are based on characterization. These values are not covered by test limits in production.

2. See also rev C errata concerning the temperature sensor.

32.8.8.2 Software-based Refinement of the Actual Temperature

The temperature sensor behavior is linear but it depends on several parameters such as the internal voltage reference

which itself depends on the temperature. To take this into account, each device contains a Temperature Log row with

data measured and written during the production tests. These calibration values should be read by software to infer the

most accurate temperature readings possible.

This Software Temperature Log row can be read at address 0x00806030. The Software Temperature Log row cannot be

written.

This section specifies the Temperature Log row content and explains how to refine the temperature sensor output using

the values in the Temperature Log row.

Temperature Log Row

All values in this row were measured in the following conditions:

z V

DDIN

= V

DDIO

= V

DDANA

= 3.3V

z ADC Clock speed = 1MHz

z ADC mode: Free running mode, ADC averaging mode with 4 averaged samples

z ADC voltage reference = 1.0V internal reference (aka INT1V)

z ADC input = temperature sensor

Table 32-28. Temperature Log Row Content

Symbol Parameter Conditions Min. Typ. Max. Units

Temperature sensor output

voltage

T= 25°C, V

DDANA

= 3.3V - 0.667 - V

Temperature sensor slope 2.3 2.4 2.5 mV/°C

Variation over V

DDANA

voltage V

DDANA

=1.62V to 3.6V -1.7 1 3.7 mV/V

Bit Position Name Description

7:0 ROOM_TEMP_VAL_INT Integer part of room temperature in °C

11:8 ROOM_TEMP_VAL_DEC Decimal part of room temperature

19:12 HOT_TEMP_VAL_INT Integer part of hot temperature in °C

23:20 HOT_TEMP_VAL_DEC Decimal part of hot temperature

31:24 ROOM_INT1V_VAL

2’s complement of the internal 1V reference drift at room

temperature (versus a 1.0 centered value)