Datasheet
Table Of Contents
- Description
- Features
- 1. Configuration Summary
- 2. Ordering Information
- 3. Block Diagram
- 4. Pinout
- 5. I/O Multiplexing and Considerations
- 6. Signal Descriptions List
- 7. Power Supply and Start-Up Considerations
- 8. Product Mapping
- 9. Memories
- 10. Processor and Architecture
- 11. Peripherals Configuration Overview
- 12. DSU – Device Service Unit
- 12.1 Overview
- 12.2 Features
- 12.3 Block Diagram
- 12.4 Signal Description
- 12.5 Product Dependencies
- 12.6 Debug Operation
- 12.7 Chip-Erase
- 12.8 Programming
- 12.9 Intellectual Property Protection
- 12.10 Device Identification
- 12.11 Functional Description
- 12.12 Register Summary
- 12.13 Register Description
- 12.13.1 Control
- 12.13.2 Status A
- 12.13.3 Status B
- 12.13.4 Address
- 12.13.5 Length
- 12.13.6 Data
- 12.13.7 Debug Communication Channel n
- 12.13.8 Device Identification
- 12.13.9 CoreSight ROM Table Entry n
- 12.13.10 CoreSight ROM Table End
- 12.13.11 Coresight ROM Table Memory Type
- 12.13.12 Peripheral Identification 4
- 12.13.13 Peripheral Identification 0
- 12.13.14 Peripheral Identification 1
- 12.13.15 Peripheral Identification 2
- 12.13.16 Peripheral Identification 3
- 12.13.17 Component Identification 0
- 12.13.18 Component Identification 1
- 12.13.19 Component Identification 2
- 12.13.20 Component Identification 3
- 13. Clock System
- 14. GCLK – Generic Clock Controller
- 14.1 Overview
- 14.2 Features
- 14.3 Block Diagram
- 14.4 Signal Description
- 14.5 Product Dependencies
- 14.6 Functional Description
- 14.6.1 Principle of Operation
- 14.6.2 Basic Operation
- 14.6.2.1 Initialization
- 14.6.2.2 Enabling, Disabling and Resetting
- 14.6.2.3 Generic Clock Generator
- 14.6.2.4 Enabling a Generic Clock Generator
- 14.6.2.5 Disabling a Generic Clock Generator
- 14.6.2.6 Selecting a Clock Source for the Generic Clock Generator
- 14.6.2.7 Changing Clock Frequency
- 14.6.2.8 Duty Cycle
- 14.6.2.9 Generic Clock Output on I/O Pins
- 14.6.3 Generic Clock
- 14.6.4 Additional Features
- 14.6.5 Sleep Mode Operation
- 14.6.6 Synchronization
- 14.7 Register Summary
- 14.8 Register Description
- 15. PM – Power Manager
- 15.1 Overview
- 15.2 Features
- 15.3 Block Diagram
- 15.4 Signal Description
- 15.5 Product Dependencies
- 15.6 Functional Description
- 15.6.1 Principle of Operation
- 15.6.2 Basic Operation
- 15.6.2.1 Initialization
- 15.6.2.2 Enabling, Disabling and Resetting
- 15.6.2.3 Selecting the Main Clock Source
- 15.6.2.4 Selecting the Synchronous Clock Division Ratio
- 15.6.2.5 Clock Ready Flag
- 15.6.2.6 Peripheral Clock Masking
- 15.6.2.7 Clock Failure Detector
- 15.6.2.8 Reset Controller
- 15.6.2.9 Sleep Mode Controller
- 15.6.3 SleepWalking
- 15.6.4 Interrupts
- 15.6.5 Events
- 15.6.6 Sleep Mode Operation
- 15.7 Register Summary
- 15.8 Register Description
- 15.8.1 Control
- 15.8.2 Sleep Mode
- 15.8.3 CPU Clock Select
- 15.8.4 APBA Clock Select
- 15.8.5 APBB Clock Select
- 15.8.6 APBC Clock Select
- 15.8.7 AHB Mask
- 15.8.8 APBA Mask
- 15.8.9 APBB Mask
- 15.8.10 APBC Mask
- 15.8.11 Interrupt Enable Clear
- 15.8.12 Interrupt Enable Set
- 15.8.13 Interrupt Flag Status and Clear
- 15.8.14 Reset Cause
- 16. SYSCTRL – System Controller
- 16.1 Overview
- 16.2 Features
- 16.3 Block Diagram
- 16.4 Signal Description
- 16.5 Product Dependencies
- 16.6 Functional Description
- 16.6.1 Principle of Operation
- 16.6.2 External Multipurpose Crystal Oscillator (XOSC) Operation
- 16.6.3 32kHz External Crystal Oscillator (XOSC32K) Operation
- 16.6.4 32kHz Internal Oscillator (OSC32K) Operation
- 16.6.5 32kHz Ultra Low Power Internal Oscillator (OSCULP32K) Operation
- 16.6.6 8MHz Internal Oscillator (OSC8M) Operation
- 16.6.7 Digital Frequency Locked Loop (DFLL48M) Operation
- 16.6.8 3.3V Brown-Out Detector Operation
- 16.6.9 Voltage Reference System Operation
- 16.6.10 Interrupts
- 16.6.11 Synchronization
- 16.7 Register Summary
- 16.8 Register Description
- 16.8.1 Interrupt Enable Clear
- 16.8.2 Interrupt Enable Set
- 16.8.3 Interrupt Flag Status and Clear
- 16.8.4 Power and Clocks Status
- 16.8.5 External Multipurpose Crystal Oscillator (XOSC) Control
- 16.8.6 32kHz External Crystal Oscillator (XOSC32K) Control
- 16.8.7 32kHz Internal Oscillator (OSC32K) Control
- 16.8.8 32kHz Ultra Low Power Internal Oscillator (OSCULP32K) Control
- 16.8.9 8MHz Internal Oscillator (OSC8M) Control
- 16.8.10 DFLL48M Control
- 16.8.11 DFLL48M Value
- 16.8.12 DFLL48M Multiplier
- 16.8.13 DFLL48M Synchronization
- 16.8.14 3.3V Brown-Out Detector (BOD33) Control
- 16.8.15 Voltage Regulator System (VREG) Control
- 16.8.16 Voltage References System (VREF) Control
- 17. WDT – Watchdog Timer
- 18. RTC – Real-Time Counter
- 18.1 Overview
- 18.2 Features
- 18.3 Block Diagram
- 18.4 Signal Description
- 18.5 Product Dependencies
- 18.6 Functional Description
- 18.7 Register Summary
- 18.8 Register Description
- 18.8.1 Control
- 18.8.2 Read Request
- 18.8.3 Event Control
- 18.8.4 Interrupt Enable Clear
- 18.8.5 Interrupt Enable Set
- 18.8.6 Interrupt Flag Status and Clear
- 18.8.7 Status
- 18.8.8 Debug Control
- 18.8.9 Frequency Correction
- 18.8.10 Counter Value
- 18.8.11 Clock Value
- 18.8.12 Counter Period
- 18.8.13 Compare n Value
- 18.8.14 Alarm n Value
- 18.8.15 Alarm n Mask
- 19. EIC – External Interrupt Controller
- 20. NVMCTRL – Non-Volatile Memory Controller
- 20.1 Overview
- 20.2 Features
- 20.3 Block Diagram
- 20.4 Signal Description
- 20.5 Product Dependencies
- 20.6 Functional Description
- 20.7 Register Summary
- 20.8 Register Description
- 21. PORT
- 21.1 Overview
- 21.2 Features
- 21.3 Block Diagram
- 21.4 Signal Description
- 21.5 Product Dependencies
- 21.6 Functional Description
- 21.7 Register Summary
- 21.8 Register Description
- 21.8.1 Data Direction
- 21.8.2 Data Direction Clear
- 21.8.3 Data Direction Set
- 21.8.4 Data Direction Toggle
- 21.8.5 Data Output Value
- 21.8.6 Data Output Value Clear
- 21.8.7 Data Output Value Set
- 21.8.8 Data Output Value Toggle
- 21.8.9 Data Input Value
- 21.8.10 Control
- 21.8.11 Write Configuration
- 21.8.12 Peripheral Multiplexing n
- 21.8.13 Pin Configuration y
- 22. EVSYS – Event System
- 23. SERCOM – Serial Communication Interface
- 24. SERCOM USART – SERCOM Universal Synchronous and Asynchronous Receiver and Transmitter
- 24.1 Overview
- 24.2 Features
- 24.3 Block Diagram
- 24.4 Signal Description
- 24.5 Product Dependencies
- 24.6 Functional Description
- 24.7 Register Summary
- 24.8 Register Description
- 25. SERCOM SPI – SERCOM Serial Peripheral Interface
- 25.1 Overview
- 25.2 Features
- 25.3 Block Diagram
- 25.4 Signal Description
- 25.5 Product Dependencies
- 25.6 Functional Description
- 25.7 Register Summary
- 25.8 Register Description
- 26. SERCOM I2C – SERCOM Inter-Integrated Circuit
- 26.1 Overview
- 26.2 Features
- 26.3 Block Diagram
- 26.4 Signal Description
- 26.5 Product Dependencies
- 26.6 Functional Description
- 26.7 Register Summary
- 26.8 Register Description
- 27. TC – Timer/Counter
- 27.1 Overview
- 27.2 Features
- 27.3 Block Diagram
- 27.4 Signal Description
- 27.5 Product Dependencies
- 27.6 Functional Description
- 27.7 Register Summary
- 27.8 Register Description
- 27.8.1 Control A
- 27.8.2 Read Request
- 27.8.3 Control B Clear
- 27.8.4 Control B Set
- 27.8.5 Control C
- 27.8.6 Debug Control
- 27.8.7 Event Control
- 27.8.8 Interrupt Enable Clear
- 27.8.9 Interrupt Enable Set
- 27.8.10 Interrupt Flag Status and Clear
- 27.8.11 Status
- 27.8.12 Counter Value
- 27.8.13 Period Value
- 27.8.14 Compare/Capture
- 28. ADC – Analog-to-Digital Converter
- 28.1 Overview
- 28.2 Features
- 28.3 Block Diagram
- 28.4 Signal Description
- 28.5 Product Dependencies
- 28.6 Functional Description
- 28.6.1 Principle of Operation
- 28.6.2 Basic Operation
- 28.6.3 Prescaler
- 28.6.4 ADC Resolution
- 28.6.5 Differential and Single-Ended Conversions
- 28.6.6 Accumulation
- 28.6.7 Averaging
- 28.6.8 Oversampling and Decimation
- 28.6.9 Window Monitor
- 28.6.10 Offset and Gain Correction
- 28.6.11 Interrupts
- 28.6.12 Events
- 28.6.13 Sleep Mode Operation
- 28.6.14 Synchronization
- 28.7 Register Summary
- 28.8 Register Description
- 28.8.1 Control A
- 28.8.2 Reference Control
- 28.8.3 Average Control
- 28.8.4 Sampling Time Control
- 28.8.5 Control B
- 28.8.6 Window Monitor Control
- 28.8.7 Software Trigger
- 28.8.8 Input Control
- 28.8.9 Event Control
- 28.8.10 Interrupt Enable Clear
- 28.8.11 Interrupt Enable Set
- 28.8.12 Interrupt Flag Status and Clear
- 28.8.13 Status
- 28.8.14 Result
- 28.8.15 Window Monitor Lower Threshold
- 28.8.16 Window Monitor Upper Threshold
- 28.8.17 Gain Correction
- 28.8.18 Offset Correction
- 28.8.19 Calibration
- 28.8.20 Debug Control
- 29. AC – Analog Comparators
- 29.1 Overview
- 29.2 Features
- 29.3 Block Diagram
- 29.4 Signal Description
- 29.5 Product Dependencies
- 29.6 Functional Description
- 29.7 Additional Features
- 29.8 Register Summary
- 29.9 Register Description
- 30. DAC – Digital-to-Analog Converter
- 30.1 Overview
- 30.2 Features
- 30.3 Block Diagram
- 30.4 Signal Description
- 30.5 Product Dependencies
- 30.6 Functional Description
- 30.7 Register Summary
- 30.8 Register Description
- 31. PTC - Peripheral Touch Controller
- 32. Electrical Characteristics
- 32.1 Disclaimer
- 32.2 Absolute Maximum Ratings
- 32.3 General Operating Ratings
- 32.4 Supply Characteristics
- 32.5 Maximum Clock Frequencies
- 32.6 Power Consumption
- 32.7 I/O Pin Characteristics
- 32.8 Analog Characteristics
- 32.8.1 Voltage Regulator Characteristics
- 32.8.2 Power-On Reset (POR) Characteristics
- 32.8.3 Brown-Out Detectors Characteristics
- 32.8.4 Analog-to-Digital (ADC) characteristics
- 32.8.5 Digital to Analog Converter (DAC) Characteristics
- 32.8.6 Analog Comparator Characteristics
- 32.8.7 Bandgap Reference Characteristics
- 32.8.8 Temperature Sensor Characteristics
- 32.9 NVM Characteristics
- 32.10 Oscillators Characteristics
- 32.10.1 Crystal Oscillator (XOSC) Characteristics
- 32.10.2 External 32 kHz Crystal Oscillator (XOSC32K) Characteristics
- 32.10.3 Digital Frequency Locked Loop (DFLL48M) Characteristics
- 32.10.4 32.768kHz Internal oscillator (OSC32K) Characteristics
- 32.10.5 Ultra Low Power Internal 32kHz RC Oscillator (OSCULP32K) Characteristics
- 32.10.6 8MHz RC Oscillator (OSC8M) Characteristics
- 32.11 PTC Typical Characteristics
- 32.12 Timing Characteristics
- 33. Packaging Information
- 34. Schematic Checklist
- 35. Errata
- 36. Datasheet Revision History
- Appendix A. Conventions
- Appendix B. Acronyms and Abbreviations
- Table of Contents

41
Atmel | SMART SAM D20 [DATASHEET]
Atmel-42129K–SAM-D20_datasheet–06/2014
tem continues to be held in this static state until the internally regulated supplies have reached a safe operating
state.
2. The PM starts, clocks are switched to the slow clock (Core Clock, System Clock, Flash Clock and any Bus Clocks
that do not have clock gate control). Internal resets are maintained due to the external reset.
3. The debugger maintains a low level on SWCLK. Releasing RESET
results in a debugger Cold-Plugging
procedure.
4. The debugger generates a clock signal on the SWCLK pin, the Debug Access Port (DAP) receives a clock.
5. The CPU remains in reset due to the Cold-Plugging procedure; meanwhile, the rest of the system is released.
6. A Chip-Erase is issued to ensure that the flash is fully erased prior to programming.
7. Programming is available through the AHB-AP.
8. After operation is completed, the chip can be restarted either by asserting RESET
, toggling power or writing a one
to the Status A register CPU Reset Phase Extension bit (STATUSA.CRSTEXT). Make sure that the SWCLK pin is
high when releasing RESET
to prevent extending the CPU reset.
12.9 Intellectual Property Protection
Intellectual property protection consists of restricting access to internal memories from external tools when the device is
protected, and is accomplished by setting the NVMCTRL security bit (refer to “Security Bit” on page 264). This protected
state can be removed by issuing a Chip-Erase (refer to “Chip-Erase” on page 40). When the device is protected,
read/write accesses using the AHB-AP are limited to the DSU address range and DSU commands are restricted.
The DSU implements a security filter that monitors the AHB transactions generated by the ARM AHB-AP inside the DAP.
If the device is protected, then AHB-AP read/write accesses outside the DSU external address range are discarded,
causing an error response that sets the ARM AHB-AP sticky error bits (refer to the ARM Debug Interface v5 Architecture
Specification on http://www.arm.com).
The DSU is intended to be accessed either:
z Internally from the CPU, without any limitation, even when the device is protected
z Externally from a debug adapter, with some restrictions when the device is protected
For security reasons, DSU features have limitations when used from a debug adapter. To differentiate external accesses
from internal ones, the first 0x100 bytes of the DSU register map have been replicated at offset 0x100:
z The first 0x100 bytes form the internal address range
z The next 0x100 bytes form the external address range
When the device is protected, the DAP can only issue MEM-AP accesses in the DSU address range limited to the 0x100-
0x2000 offset range.
The DSU operating registers are located in the 0x00-0xFF area and remapped in 0x100-0x1FF to differentiate accesses
coming from a debugger and the CPU. If the device is protected and an access is issued in the region 0x100-0x1FF, it is
subject to security restrictions. For more information, refer to Table 12-1.