Datasheet

1170
SAM4S Series [DATASHEET]
11100F–ATARM–29-Jan-14
Figure 45-7. UBM Pad Installation
This package respects the recommendations of the NEMI User Group.
Edge Ball Center to Center
D1 2.8 BSC
E1 2.8 BSC
Package Edge Tolerance aaa 0.03
Coplanarity (Whole Wafer) ccc 0.075
Ball/Bump Offset (Package) ddd 0.05
Ball/Bump Offset (Ball) eee 0.015
Table 45-20. WLCSP Package Reference - Soldering Information (Substrate Level)
UBM Pad (Under Bump Metallurgy) (E) 200 µm
PBO2 Opening (j) 240 µm
Table 45-21. Device and 64-ball WLCSP Package Maximum Weight
SAM4S TBD mg
Table 45-22. 64-ball WLCSP Package Characteristics
Moisture Sensitivity Level 1
Table 45-23. 64-ball WLCSP Package Reference
JEDEC Drawing Reference Not JEDEC
JESD97 Classification e1
Table 45-19. 64-ball WLCSP Package Dimensions (in mm)
Symbol
Common Dimensions
MIN. NOM. MAX.