Datasheet

1163
SAM4S Series [DATASHEET]
11100F–ATARM–29-Jan-14
Figure 45-2. 100-ball TFBGA Package Drawing
This package respects the recommendations of the NEMI User Group.
Table 45-4. TFBGA Package Reference - Soldering Information (Substrate Level)
Ball Land Diameter 450 µm
Soldering Mask Opening 350 µm
Table 45-5. Device and 100-ball TFBGA Package Maximum Weight
SAM4S 141 mg
Table 45-6. 100-ball TFBGA Package Characteristics
Moisture Sensitivity Level 3
100-ball TFBGA Package Reference
JEDEC Drawing Reference MO-275-DDAC-1
JESD97 Classification e8