Datasheet

1173
SAM4S Series [DATASHEET]
11100F–ATARM–29-Jan-14
45.1 Soldering Profile
Table 45-30 gives the recommended soldering profile from J-STD-020C.
Note: The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
45.2 Packaging Resources
Land Pattern Definition.
Refer to the following IPC Standards:
 IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern Standards)
http://landpatterns.ipc.org/default.asp
 Atmel Green and RoHS Policy and Package Material Declaration Data Sheet http://www.atmel.com/green/
Table 45-30. Soldering Profile
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/sec. max.
Preheat Temperature 175°C ± 25°C 180 sec. max.
Temperature Maintained Above 217°C 60 sec. to 150 sec.
Time within 5
°C of Actual Peak Temperature 20 sec. to 40 sec.
Peak Temperature Range 260
°C
Ramp-down Rate 6
°C/sec. max.
Time 25
°C to Peak Temperature 8 min. max.