Datasheet

1165
SAM4S Series [DATASHEET]
11100F–ATARM–29-Jan-14
This package respects the recommendations of the NEMI User Group.
Stand Off: A1 0.160 ~ 0.260
Ball Width: b 0.270 ~ 0.370
Package Edge Tolerance: aaa 0.100
Mold Flatness: bbb 0.100
Coplanarity: ddd 0.080
Ball Offset (Package): eee 0.150
Ball Offset (Ball): fff 0.080
Ball Count: n 100
Edge Ball Center to Center:
XE1 5.850
YD1 5.850
Corner Ball Center to Package Edge:
XI 0.575
YJ 0.575
Table 45-8. VFBGA Package Reference - Soldering Information (Substrate Level)
Ball Land Diameter 0.27 mm
Soldering Mask Opening 275 µm
Table 45-9. Device and 100-ball VFBGA Package Maximum Weight
SAM4S 75 mg
Table 45-10. 100-ball VFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 45-11. 100-ball VFBGA Package Reference
JEDEC Drawing Reference MO-275-BBE-1
JESD97 Classification e8
Table 45-7. VFBGA Package Dimensions (Continued)
Symbol Common Dimensions (mm)