Datasheet

SAM4S Series [DATASHEET]
Atmel-11100G-ATARM-SAM4S-Datasheet_27-May-14
1186
Figure 45-3. 100-ball VFBGA Package Drawing
Table 45-7. VFBGA Package Dimensions
Symbol Common Dimensions (mm)
Package: VFBGA
Body Size:
X E 7.000 ± 0.100
Y D 7.000 ± 0.100
Ball Pitch:
XeE 0.650
YeD 0.650
Total Thickness: A 1.000 max
Mold Thickness: M 0.450 ref.
Substrate Thickness: S 0.210 ref.
Ball Diameter: 0.300