Datasheet

1091
SAM4S [DATASHEET]
11100E–ATARM–24-Jul-13
Figure 44-2. 100-ball TFBGA Package Drawing
This package respects the recommendations of the NEMI User Group.
Table 44-4. TFBGA Package Reference - Soldering Information (Substrate Level)
Ball Land Diameter 450 μm
Soldering Mask Opening 350 μm
Table 44-5. Device and 100-ball TFBGA Package Maximum Weight
SAM4S 141 mg
Table 44-6. 100-ball TFBGA Package Characteristics
Moisture Sensitivity Level 3
100-ball TFBGA Package Reference
JEDEC Drawing Reference MO-275-DDAC-1
JESD97 Classification e8