Datasheet
22
SAM4N Series [SUMMARY DATASHEET]
11158AS–ATARM–06-Jun-13
This package respects the recommendations of the NEMI User Group.
Table 5-8. VFBGA Package Reference - Soldering Information (Substrate Level)
Ball Land Diameter 0.27 mm
Soldering Mask Opening 275 μm
Table 5-9. Device and 100-ball VFBGA Package Maximum Weight
SAM4N 75 mg
Table 5-10. 100-ball VFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 5-11. 100-ball VFBGA Package Reference
JEDEC Drawing Reference MO-275-BBE-1
JESD97 Classification e8