Datasheet

20
SAM4N Series [SUMMARY DATASHEET]
11158AS–ATARM–06-Jun-13
Figure 5-2. 100-ball TFBGA Package Drawing
This package respects the recommendations of the NEMI User Group.
Table 5-4. TFBGA Package Reference - Soldering Information (Substrate Level)
Ball Land Diameter 0.35 mm
Soldering Mask Opening 350 μm
Table 5-5. Device and 100-ball TFBGA Package Maximum Weight
SAM4N 140 mg
Table 5-6. 100-ball TFBGA Package Characteristics
Moisture Sensitivity Level 3
Table 5-7. 100-ball TFBGA Package Reference
JEDEC Drawing Reference MO-275-DDAC-01
JESD97 Classification e8