Datasheet

164
42023GS–SAM–03/2014
ATSAM4L8/L4/L2
Figure 10-11. QFN-48 Package Drawing for ATSAM4LC8 and ATSAM4LS8
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 10-32. Device and Package Maximum Weight
140 mg
Table 10-33. Package Characteristics
Moisture Sensitivity Level MSL3
Table 10-34. Package Reference
JEDEC Drawing Reference MO-220
JESD97 Classification E3