Datasheet

1180
42023E–SAM–07/2013
ATSAM4L8/L4/L2
Figure 43-6. QFN-64 Package Drawing
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 43-17. Device and Package Maximum Weight
200 mg
Table 43-18. Package Characteristics
Moisture Sensitivity Level MSL3
Table 43-19. Package Reference
JEDEC Drawing Reference MO-220
JESD97 Classification E3