Datasheet

1473
SAM4E [DATASHEET]
Atmel-11157D-ATARM-SAM4E16-SAM4E8-Datasheet_12-Jun-14
48.5 Soldering Profile
Table 48-13 gives the recommended soldering profile from J-STD-020C.
Note: The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
48.6 Packaging Resources
Land Pattern Definition.
Refer to the following IPC Standards:
 IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern Standards)
http://landpatterns.ipc.org/default.asp
 Atmel Green and RoHS Policy and Package Material Declaration Data Sheet http://www.atmel.com/green/
Table 48-13. Soldering Profile
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/sec. max.
Preheat Temperature 175°C ±25°C 180 sec. max.
Temperature Maintained Above 217°C 60 sec. to 150 sec.
Time within 5°C of Actual Peak Temperature 20 sec. to 40 sec.
Peak Temperature Range 260°C
Ramp-down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 min. max.