Datasheet

739
11011B–ATARM–21-Feb-12
SAM3N
36.1 Soldering Profile
Table 36-18 gives the recommended soldering profile from J-STD-020C.
Note: The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
36.2 Packaging Resources
Land Pattern Definition.
Refer to the following IPC Standards:
• IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern
Standards) http://landpatterns.ipc.org/default.asp
• Atmel Green and RoHS Policy and Package Material Declaration Data Sheet
http://www.atmel.com/green/
Table 36-18. Soldering Profile
Profile Feature Green Package
Average Ramp-up Rate (217°C to Peak) 3°C/sec. max.
Preheat Temperature 175°C ±25°C 180 sec. max.
Temperature Maintained Above 217°C 60 sec. to 150 sec.
Time within 5° C of Actual Peak Temperature 20 sec. to 40 sec.
Peak Temperature Range 260° C
Ramp-down Rate 6°C/sec. max.
Time 25°C to Peak Temperature 8 min. max.