Datasheet

28
11011B–ATARM–21-Feb-12
SAM3N
7.2 Embedded Memories
7.2.1 Internal SRAM
The SAM3N4 product embeds a total of 24-Kbytes high-speed SRAM.
The SAM3N2 product embeds a total of 16-Kbytes high-speed SRAM.
The SAM3N1 product embeds a total of 8-Kbytes high-speed SRAM.
The SAM3N0 product embeds a total of 8-Kbytes high-speed SRAM.
The SAM3N00 product embeds a total of 4-Kbytes high-speed SRAM.
The SRAM is accessible over System Cortex-M3 bus at address 0x2000 0000.
The SRAM is in the bit band region. The bit band alias region is from 0x2200 0000 and 0x23FF
FFFF.
RAM size must be configurable by calibration fuses.
7.2.2 Internal ROM
The SAM3N product embeds an Internal ROM, which contains the SAM Boot Assistant
(SAM-BA), In Application Programming routines (IAP) and Fast Flash Programming Interface
(FFPI).
At any time, the ROM is mapped at address 0x0080 0000.
7.2.3 Embedded Flash
7.2.3.1 Flash Overview
The Flash of the SAM3N4 (256 Kbytes) is organized in one bank of 1024 pages of 256 bytes
(Single plane).
The Flash of the SAM3N2 (128 Kbytes) is organized in one bank of 512 pages of 256 bytes
(Single Plane).
The Flash of the SAM3N1 (64 Kbytes) is organized in one bank of 256 pages of 256 bytes
(Single plane).
The Flash of the SAM3N0 (32 Kbytes) is organized in one bank of 128 pages of 256 bytes
(Single plane).
The Flash of the SAM3N00 (16 Kbytes) is organized in one bank of 64 pages of 256 bytes
(Single plane).
The Flash contains a 128-byte write buffer, accessible through a 32-bit interface.
7.2.3.2 Flash Power Supply
The Flash is supplied by VDDCORE.
7.2.3.3 Enhanced Embedded Flash Controller
The Enhanced Embedded Flash Controller (EEFC) manages accesses performed by the mas-
ters of the system. It enables reading the Flash and writing the write buffer. It also contains a
User Interface, mapped on the APB.
The Enhanced Embedded Flash Controller ensures the interface of the Flash block with the 32-
bit internal bus. Its 128-bit wide memory interface increases performance.