Datasheet

For the most current package drawings, see the Microchip Packaging Specification located at http://
www.microchip.com/packaging
TITLE
DRAWING NO.GPC
REV.
Package Drawing Contact:
[e-mail]
28M1ZBV B
28M1,28-pad, 4 x 4 x 1.0mm Body, Lead Pitch 0.45mm,
2.4 x 2.4mm Exposed Pad, Thermally Enhanced
Plastic Very Thin Quad Flat No Lead Package (VQFN)
10/24/08
SIDE VIEW
Pin 1 ID
BOTTOM VIEW
TOP VIEW
Note:
The ter mi nal #1 ID is a Laser -ma r ked Feat ur e .
D
E
e
K
A1
C
A
D2
E2
y
L
1
2
3
b
1
2
3
0.45
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
R 0.20
0.4 Ref
(4x)
A
A1
b
C
D
D2
E
E2
e
L
y
K
0.80 0.90 1.00
0.00 0.02 0.05
0.17 0.22 0.27
0.20 REF
3.95 4.00 4.05
2.35 2.40 2.45
3.95 4.00 4.05
2.35 2.40 2.45
0.45
0.35 0.40 0.45
0.00 – 0.08
0.20 – –
37.5 28-pin 28P3
Note:
Note: For the most current package drawings, see the Microchip Packaging Specification located at http://
www.microchip.com/packaging
ATmega48PA/88PA/168PA
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40002011A-page 484