Datasheet
Table Of Contents
- Features
- Pin Configurations
- Overview
- Resources
- Data Retention
- About Code Examples
- Atmel AVR CPU Core
- AVR ATmega8 Memories
- System Clock and Clock Options
- Power Management and Sleep Modes
- System Control and Reset
- Interrupts
- I/O Ports
- Introduction
- Ports as General Digital I/O
- Alternate Port Functions
- Register Description for I/O Ports
- The Port B Data Register – PORTB
- The Port B Data Direction Register – DDRB
- The Port B Input Pins Address – PINB
- The Port C Data Register – PORTC
- The Port C Data Direction Register – DDRC
- The Port C Input Pins Address – PINC
- The Port D Data Register – PORTD
- The Port D Data Direction Register – DDRD
- The Port D Input Pins Address – PIND
- External Interrupts
- 8-bit Timer/Counter0
- Timer/Counter0 and Timer/Counter1 Prescalers
- 16-bit Timer/Counter1
- Overview
- Accessing 16-bit Registers
- Timer/Counter Clock Sources
- Counter Unit
- Input Capture Unit
- Output Compare Units
- Compare Match Output Unit
- Modes of Operation
- Timer/Counter Timing Diagrams
- 16-bit Timer/Counter Register Description
- Timer/Counter 1 Control Register A – TCCR1A
- Timer/Counter 1 Control Register B – TCCR1B
- Timer/Counter 1 – TCNT1H and TCNT1L
- Output Compare Register 1 A – OCR1AH and OCR1AL
- Output Compare Register 1 B – OCR1BH and OCR1BL
- Input Capture Register 1 – ICR1H and ICR1L
- Timer/Counter Interrupt Mask Register – TIMSK(1)
- Timer/Counter Interrupt Flag Register – TIFR(1)
- 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- Serial Peripheral Interface – SPI
- USART
- Two-wire Serial Interface
- Analog Comparator
- Analog-to- Digital Converter
- Boot Loader Support – Read- While-Write Self- Programming
- Boot Loader Features
- Application and Boot Loader Flash Sections
- Read-While-Write and No Read- While-Write Flash Sections
- Boot Loader Lock Bits
- Entering the Boot Loader Program
- Addressing the Flash During Self- Programming
- Self-Programming the Flash
- Performing Page Erase by SPM
- Filling the Temporary Buffer (Page Loading)
- Performing a Page Write
- Using the SPM Interrupt
- Consideration While Updating BLS
- Prevent Reading the RWW Section During Self-Programming
- Setting the Boot Loader Lock Bits by SPM
- EEPROM Write Prevents Writing to SPMCR
- Reading the Fuse and Lock Bits from Software
- Preventing Flash Corruption
- Programming Time for Flash when using SPM
- Simple Assembly Code Example for a Boot Loader
- ATmega8 Boot Loader Parameters
- Memory Programming
- Program And Data Memory Lock Bits
- Fuse Bits
- Signature Bytes
- Calibration Byte
- Page Size
- Parallel Programming Parameters, Pin Mapping, and Commands
- Parallel Programming
- Enter Programming Mode
- Considerations for Efficient Programming
- Chip Erase
- Programming the Flash
- Programming the EEPROM
- Reading the Flash
- Reading the EEPROM
- Programming the Fuse Low Bits
- Programming the Fuse High Bits
- Programming the Lock Bits
- Reading the Fuse and Lock Bits
- Reading the Signature Bytes
- Reading the Calibration Byte
- Parallel Programming Characteristics
- Serial Downloading
- Serial Programming Pin Mapping
- Electrical Characteristics – TA = -40°C to 85°C
- Electrical Characteristics – TA = -40°C to 105°C
- ATmega8 Typical Characteristics – TA = -40°C to 85°C
- Active Supply Current
- Idle Supply Current
- Power-down Supply Current
- Power-save Supply Current
- Standby Supply Current
- Pin Pull-up
- Pin Driver Strength
- Pin Thresholds and Hysteresis
- Bod Thresholds and Analog Comparator Offset
- Internal Oscillator Speed
- Current Consumption of Peripheral Units
- Current Consumption in Reset and Reset Pulsewidth
- ATmega8 Typical Characteristics – TA = -40°C to 105°C
- Register Summary
- Instruction Set Summary
- Ordering Information
- Packaging Information
- Errata
- Datasheet Revision History
- Changes from Rev. 2486Z- 02/11 to Rev. 2486AA- 02/2013
- Changes from Rev. 2486Y- 10/10 to Rev. 2486Z- 02/11
- Changes from Rev. 2486X- 06/10 to Rev. 2486Y- 10/10
- Changes from Rev. 2486W- 02/10 to Rev. 2486X- 06/10
- Changes from Rev. 2486V- 05/09 to Rev. 2486W- 02/10
- Changes from Rev. 2486U- 08/08 to Rev. 2486V- 05/09
- Changes from Rev. 2486T- 05/08 to Rev. 2486U- 08/08
- Changes from Rev. 2486S- 08/07 to Rev. 2486T- 05/08
- Changes from Rev. 2486R- 07/07 to Rev. 2486S- 08/07
- Changes from Rev. 2486Q- 10/06 to Rev. 2486R- 07/07
- Changes from Rev. 2486P- 02/06 to Rev. 2486Q- 10/06
- Changes from Rev. 2486O-10/04 to Rev. 2486P- 02/06
- Changes from Rev. 2486N-09/04 to Rev. 2486O-10/04
- Changes from Rev. 2486M-12/03 to Rev. 2486N-09/04
- Changes from Rev. 2486L-10/03 to Rev. 2486M-12/03
- Changes from Rev. 2486K-08/03 to Rev. 2486L-10/03
- Changes from Rev. 2486J-02/03 to Rev. 2486K-08/03
- Changes from Rev. 2486I-12/02 to Rev. 2486J-02/03
- Changes from Rev. 2486H-09/02 to Rev. 2486I-12/02
- Changes from Rev. 2486G-09/02 to Rev. 2486H-09/02
- Changes from Rev. 2486F-07/02 to Rev. 2486G-09/02
- Changes from Rev. 2486E-06/02 to Rev. 2486F-07/02
- Changes from Rev. 2486D-03/02 to Rev. 2486E-06/02
- Changes from Rev. 2486C-03/02 to Rev. 2486D-03/02
- Changes from Rev. 2486B-12/01 to Rev. 2486C-03/02
- Table of Contents
28
2486AA–AVR–02/2013
ATmega8(L)
Notes: 1. These options should only be used when not operating close to the maximum frequency of the
device, and only if frequency stability at start-up is not important for the application. These
options are not suitable for crystals
2. These options are intended for use with ceramic resonators and will ensure frequency stability
at start-up. They can also be used with crystals when not operating close to the maximum fre-
quency of the device, and if frequency stability at start-up is not important for the application
Low-frequency
Crystal Oscillator
To use a 32.768kHz watch crystal as the clock source for the device, the Low-frequency Crystal
Oscillator must be selected by setting the CKSEL Fuses to “1001”. The crystal should be con-
nected as shown in Figure 11 on page 27. By programming the CKOPT Fuse, the user can
enable internal capacitors on XTAL1 and XTAL2, thereby removing the need for external capac-
itors. The internal capacitors have a nominal value of 36pF.
When this Oscillator is selected, start-up times are determined by the SUT Fuses as shown in
Table 6.
Note: 1. These options should only be used if frequency stability at start-up is not important for the
application
External RC
Oscillator
For timing insensitive applications, the external RC configuration shown in Figure 12 on page 29
can be used. The frequency is roughly estimated by the equation f = 1/(3RC). C should be at
Table 5. Start-up Times for the Crystal Oscillator Clock Selection
CKSEL0 SUT1..0
Start-up Time
from Power-down
and Power-save
Additional Delay
from Reset
(V
CC
= 5.0V) Recommended Usage
0 00 258 CK
(1)
4.1ms
Ceramic resonator, fast
rising power
0 01 258 CK
(1)
65ms
Ceramic resonator, slowly
rising power
010 1K CK
(2)
–
Ceramic resonator, BOD
enabled
011 1K CK
(2)
4.1ms
Ceramic resonator, fast
rising power
100 1K CK
(2)
65ms
Ceramic resonator, slowly
rising power
101 16K CK –
Crystal Oscillator, BOD
enabled
1 10 16K CK 4.1ms
Crystal Oscillator, fast
rising power
1 11 16K CK 65ms
Crystal Oscillator, slowly
rising power
Table 6. Start-up Times for the Low-frequency Crystal Oscillator Clock Selection
SUT1..0
Start-up Time from
Power-down and
Power-save
Additional Delay
from Reset
(V
CC
= 5.0V) Recommended Usage
00 1K CK
(1)
4.1ms Fast rising power or BOD enabled
01 1K CK
(1)
65ms Slowly rising power
10 32K CK 65ms Stable frequency at start-up
11 Reserved