Datasheet

3
ATmega325/3250/645/6450
2570K–AVR–04/07
Figure 2. Pinout ATmega325/645
Note: The large center pad underneath the QFN/MLF packages is made of metal and internally
connected to GND. It should be soldered or glued to the board to ensure good mechani-
cal stability. If the center pad is left unconnected, the package might loosen from the
board.
Disclaimer Typical values contained in this datasheet are based on simulations and characteriza-
tion of other AVR microcontrollers manufactured on the same process technology. Min
and Max values will be available after the device is characterized.
PC0
VCC GND PF0 (ADC0) PF7 (ADC7/TDI) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) AREF GND AVCC
17
61 60
18
59
20
58
19 21
57
22
56
23
55
24
54
25
53
26
52
27
51
29 28
50 49
32 31 30
(RXD/PCINT0) PE0
(TXD/PCINT1) PE1
(XCK/AIN0/PCINT2) PE2
(AIN1/PCINT3) PE3
(USCK/SCL/PCINT4) PE4
(DI/SDA/PCINT5) PE5
(DO/PCINT6) PE6
(CLKO/PCINT7) PE7
(SCK/PCINT9) PB1
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(OC0A/PCINT12) PB4
(OC2A/PCINT15) PB7
(T1) PG3
(OC1B/PCINT14) PB6
(T0) PG4
(OC1A/PCINT13) PB5
PC1
PG0
PD7
PC2
PC3
PC4
PC5
PC6
PC7
PA7
PG2
PA6
PA5
PA4
PA3
PA0 PA1 PA2
PG1
PD6 PD5 PD4 PD3 PD2
PD1 (INT0)
(ICP1) PD0
XTAL1 (TOSC1) XTAL2 (TOSC2)
RESET/PG5
GND
VCC
INDEX CORNER
(SS/PCINT8) PB0
2
3
1
4
5
6
7
8
9
10
11
12
13
14
16
15
64 63 62
47
46
48
45
44
43
42
41
40
39
38
37
36
35
33
34
ATmega325/645
DNC