Datasheet

2
7674DS–AVR–08/08
ATmega164P/324P/644P
1. Pin Configurations
Figure 1-1. Pinout ATmega164P/324P/644P
Note: The large center pad underneath the QFN/MLF package should be soldered to ground on the
board to ensure good mechanical stability.
PA4 (ADC4/PCINT
PA5 (ADC5/PCINT
PA6 (ADC6/PCINT
PA7 (ADC7/PCINT
AREF
GND
AVCC
PC7 (TOSC2/PCIN
PC6 (TOSC1/PCIN
PC5 (TDI/PCINT2
PC4 (TDO/PCINT2
(PCINT13/MOSI) PB5
(PCINT14/MISO) PB6
(PCINT15/SCK) PB7
RESET
VCC
GND
XTAL2
XTAL1
(PCINT24/RXD0) PD0
(PCINT25/TXD0) PD1
NT/RXD1/26/INT0) PD2
(PCINT/TXD1/27/INT1) PD3
(PCINT28/XCK1/OC1B) PD4
(PCINT29/OC1A) PD5
(PCINT30/OC2B/ICP) PD6
(PCINT31/OC2A) PD7
VCC
GND
(PCINT16/SCL) PC0
(PCINT17/SDA) PC1
(PCINT18/TCK) PC2
(PCINT19/TMS) PC3
PB4 (SS/OC0B/PCINT12) PB3 (AIN1/OC0A/PCINT11) PB2 (AIN0/INT2/PCINT10) PB1 (T1/CLKO/PCINT9) PB0 (XCK0/T0/PCINT8) GND VCC PA0 (ADC0/PCINT0) PA1 (ADC1/PCINT1) PA2 (ADC2/PCINT2) PA3 (ADC3/PCINT3)
TQFP/QF N / M LF