Datasheet
Table Of Contents
- Features
- 1. Pin Configurations
- 2. Overview
- 3. Resources
- 4. Data Retention
- 5. About Code Examples
- 6. Capacitive touch sensing
- 7. AVR CPU Core
- 8. AVR Memories
- 9. System Clock and Clock Options
- 10. Power Management and Sleep Modes
- 11. System Control and Reset
- 12. Interrupts
- 13. I/O Ports
- 13.1 Overview
- 13.2 Ports as General Digital I/O
- 13.3 Alternate Port Functions
- 13.4 Register Description
- 13.4.1 SFIOR – Special Function I/O Register
- 13.4.2 PORTA – Port A Data Register
- 13.4.3 DDRA – Port A Data Direction Register
- 13.4.4 PINA – Port A Input Pins Address
- 13.4.5 PORTB – Port B Data Register
- 13.4.6 DDRB – Port B Data Direction Register
- 13.4.7 PINB – Port B Input Pins Address
- 13.4.8 PORTC – Port C Data Register
- 13.4.9 DDRC – Port C Data Direction Register
- 13.4.10 PINC – Port C Input Pins Address
- 13.4.11 PORTD – Port D Data Register
- 13.4.12 DDRD – Port D Data Direction Register
- 13.4.13 PIND – Port D Input Pins Address
- 14. External Interrupts
- 15. 8-bit Timer/Counter0 with PWM
- 16. Timer/Counter0 and Timer/Counter1 Prescalers
- 17. 16-bit Timer/Counter1
- 17.1 Features
- 17.2 Overview
- 17.3 Accessing 16-bit Registers
- 17.4 Timer/Counter Clock Sources
- 17.5 Counter Unit
- 17.6 Input Capture Unit
- 17.7 Compare Match Output Unit
- 17.8 Modes of Operation
- 17.9 Timer/Counter Timing Diagrams
- 17.10 Register Description
- 17.10.1 TCCR1A – Timer/Counter1 Control Register A
- 17.10.2 TCCR1B – Timer/Counter1 Control Register B
- 17.10.3 TCNT1H and TCNT1L – Timer/Counter1
- 17.10.4 OCR1AH and OCR1AL – Output Compare Register 1 A
- 17.10.5 OCR1BH and OCR1BL – Output Compare Register 1 B
- 17.10.6 ICR1H and ICR1L – Input Capture Register 1
- 17.10.7 TIMSK – Timer/Counter Interrupt Mask Register(1)
- 17.10.8 TIFR – Timer/Counter Interrupt Flag Register
- 18. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 18.1 Features
- 18.2 Overview
- 18.3 Timer/Counter Clock Sources
- 18.4 Counter Unit
- 18.5 Output Compare Unit
- 18.6 Compare Match Output Unit
- 18.7 Modes of Operation
- 18.8 Timer/Counter Timing Diagrams
- 18.9 Asynchronous Operation of the Timer/Counter
- 18.10 Timer/Counter Prescaler
- 18.11 Register Description
- 18.11.1 TCCR2 – Timer/Counter Control Register
- 18.11.2 TCNT2 – Timer/Counter Register
- 18.11.3 OCR2 – Output Compare Register
- 18.11.4 ‘ASSR – Asynchronous Status Register
- 18.11.5 TIMSK – Timer/Counter Interrupt Mask Register
- 18.11.6 TIFR – Timer/Counter Interrupt Flag Register
- 18.11.7 SFIOR – Special Function IO Register
- 19. SPI – Serial Peripheral Interface
- 20. USART
- 20.1 Features
- 20.2 Overview
- 20.3 Clock Generation
- 20.4 Frame Formats
- 20.5 USART Initialization
- 20.6 Data Transmission – The USART Transmitter
- 20.7 Data Reception – The USART Receiver
- 20.8 Asynchronous Data Reception
- 20.9 Multi-processor Communication Mode
- 20.10 Accessing UBRRH/ UCSRC Registers
- 20.11 Register Description
- 20.12 Examples of Baud Rate Setting
- 21. Two-wire Serial Interface
- 22. Analog Comparator
- 23. Analog to Digital Converter
- 24. JTAG Interface and On-chip Debug System
- 25. IEEE 1149.1 (JTAG) Boundary-scan
- 26. Boot Loader Support – Read-While-Write Self-Programming
- 26.1 Features
- 26.2 Overview
- 26.3 Application and Boot Loader Flash Sections
- 26.4 Read-While-Write and no Read-While-Write Flash Sections
- 26.5 Boot Loader Lock Bits
- 26.6 Entering the Boot Loader Program
- 26.7 Addressing the Flash during Self-Programming
- 26.8 Self-Programming the Flash
- 26.8.1 Performing Page Erase by SPM
- 26.8.2 Filling the Temporary Buffer (Page Loading)
- 26.8.3 Performing a Page Write
- 26.8.4 Using the SPM Interrupt
- 26.8.5 Consideration while Updating BLS
- 26.8.6 Prevent Reading the RWW Section during Self-Programming
- 26.8.7 Setting the Boot Loader Lock Bits by SPM
- 26.8.8 EEPROM Write Prevents Writing to SPMCR
- 26.8.9 Reading the Fuse and Lock Bits from Software
- 26.8.10 Preventing Flash Corruption
- 26.8.11 Programming Time for Flash when using SPM
- 26.8.12 Simple Assembly Code Example for a Boot Loader
- 26.8.13 Boot Loader Parameters
- 26.9 Register Description
- 27. Memory Programming
- 27.1 Program And Data Memory Lock Bits
- 27.2 Fuse Bits
- 27.3 Signature Bytes
- 27.4 Calibration Byte
- 27.5 Page Size
- 27.6 Parallel Programming Parameters, Pin Mapping, and Commands
- 27.7 Parallel Programming
- 27.7.1 Enter Programming Mode
- 27.7.2 Considerations for Efficient Programming
- 27.7.3 Chip Erase
- 27.7.4 Programming the Flash
- 27.7.5 Programming the EEPROM
- 27.7.6 Reading the Flash
- 27.7.7 Reading the EEPROM
- 27.7.8 Programming the Fuse Low Bits
- 27.7.9 Programming the Fuse High Bits
- 27.7.10 Programming the Lock Bits
- 27.7.11 Reading the Fuse and Lock Bits
- 27.7.12 Reading the Signature Bytes
- 27.7.13 Reading the Calibration Byte
- 27.7.14 Parallel Programming Characteristics
- 27.8 SPI Serial Downloading
- 27.9 SPI Serial Programming Pin Mapping
- 27.10 Programming via the JTAG Interface
- 27.10.1 Programming Specific JTAG Instructions
- 27.10.2 AVR_RESET ($C)
- 27.10.3 PROG_ENABLE ($4)
- 27.10.4 PROG_COMMANDS ($5)
- 27.10.5 PROG_PAGELOAD ($6)
- 27.10.6 PROG_PAGEREAD ($7)
- 27.10.7 Data Registers
- 27.10.8 Reset Register
- 27.10.9 Programming Enable Register
- 27.10.10 Programming Command Register
- 27.10.11 Virtual Flash Page Load Register
- 27.10.12 Virtual Flash Page Read Register
- 27.10.13 Programming Algorithm
- 27.10.14 Entering Programming Mode
- 27.10.15 Leaving Programming Mode
- 27.10.16 Performing Chip Erase
- 27.10.17 Programming the Flash
- 27.10.18 Reading the Flash
- 27.10.19 Programming the EEPROM
- 27.10.20 Reading the EEPROM
- 27.10.21 Programming the Fuses
- 27.10.22 Programming the Lock Bits
- 27.10.23 Reading the Fuses and Lock Bits
- 27.10.24 Reading the Signature Bytes
- 27.10.25 Reading the Calibration Byte
- 28. Electrical Characteristics
- 29. Typical Characteristics
- 29.1 Active Supply Current
- 29.2 Idle Supply Current
- 29.3 Power-down Supply Current
- 29.4 Power-save Supply Current
- 29.5 Standby Supply Current
- 29.6 Pin Pull-up
- 29.7 Pin Driver Strength
- 29.8 Pin Thresholds and Hysteresis
- 29.9 BOD Thresholds and Analog Comparator Offset
- 29.10 Internal Oscillator Speed
- 29.11 Current Consumption of Peripheral Units
- 29.12 Current Consumption in Reset and Reset Pulsewidth
- 30. Register Summary
- 31. Instruction Set Summary
- 32. Ordering Information
- 33. Packaging Information
- 34. Errata
- 35. Datasheet Revision History
- Table of Contents

199
ATmega32A [DATASHEET]
Atmel-8155D-AVR-ATmega32A-Datasheet_02/2014
23.6 Changing Channel or Reference Selection
The MUXn and REFS1:0 bits in the ADMUX Register are single buffered through a temporary register to which the
CPU has random access. This ensures that the channels and reference selection only takes place at a safe point
during the conversion. The channel and reference selection is continuously updated until a conversion is started.
Once the conversion starts, the channel and reference selection is locked to ensure a sufficient sampling time for
the ADC. Continuous updating resumes in the last ADC clock cycle before the conversion completes (ADIF in
ADCSRA is set). Note that the conversion starts on the following rising ADC clock edge after ADSC is written. The
user is thus advised not to write new channel or reference selection values to ADMUX until one ADC clock cycle
after ADSC is written.
If Auto Triggering is used, the exact time of the triggering event can be indeterministic. Special care must be taken
when updating the ADMUX Register, in order to control which conversion will be affected by the new settings.
If both ADATE and ADEN is written to one, an interrupt event can occur at any time. If the ADMUX Register is
changed in this period, the user cannot tell if the next conversion is based on the old or the new settings. ADMUX
can be safely updated in the following ways:
1. When ADATE or ADEN is cleared.
2. During conversion, minimum one ADC clock cycle after the trigger event.
3. After a conversion, before the Interrupt Flag used as trigger source is cleared.
When updating ADMUX in one of these conditions, the new settings will affect the next ADC conversion.
Special care should be taken when changing differential channels. Once a differential channel has been selected,
the gain stage may take as much as 125 µs to stabilize to the new value. Thus conversions should not be started
within the first 125 µs after selecting a new differential channel. Alternatively, conversion results obtained within
this period should be discarded.
The same settling time should be observed for the first differential conversion after changing ADC reference (by
changing the REFS1:0 bits in ADMUX).
23.6.1 ADC Input Channels
When changing channel selections, the user should observe the following guidelines to ensure that the correct
channel is selected:
In Single Conversion mode, always select the channel before starting the conversion. The channel selection may
be changed one ADC clock cycle after writing one to ADSC. However, the simplest method is to wait for the con-
version to complete before changing the channel selection.
In Free Running mode, always select the channel before starting the first conversion. The channel selection may
be changed one ADC clock cycle after writing one to ADSC. However, the simplest method is to wait for the first
conversion to complete, and then change the channel selection. Since the next conversion has already started
automatically, the next result will reflect the previous channel selection. Subsequent conversions will reflect the
new channel selection.
When switching to a differential gain channel, the first conversion result may have a poor accuracy due to the
required settling time for the automatic offset cancellation circuitry. The user should preferably disregard the first
conversion result.
23.6.2 ADC Voltage Reference
The reference voltage for the ADC (V
REF
) indicates the conversion range for the ADC. Single ended channels that
exceed V
REF
will result in codes close to 0x3FF. V
REF
can be selected as either AVCC, internal 2.56V reference, or
external AREF pin.