Datasheet

3
2552KS–AVR–04/11
ATmega329/3290/649/6490
Figure 1-2. Pinout ATmega329/649
Note: The large center pad underneath the QFN/MLF packages is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
PC0 (SEG12)
VCC GND PF0 (ADC0) PF7 (ADC7/TDI) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) AREF GND AVCC
17
61 60
18
59
20
58
19 21
57
22
56
23
55
24
54
25
53
26
52
27
51
29 28
50 49
32 31 30
(RXD/PCINT0) PE0
(TXD/PCINT1) PE1
LCDCAP
(XCK/AIN0/PCINT2) PE2
(AIN1/PCINT3) PE3
(USCK/SCL/PCINT4) PE4
(DI/SDA/PCINT5) PE5
(DO/PCINT6) PE6
(CLKO/PCINT7) PE7
(SCK/PCINT9) PB1
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(OC0A/PCINT12) PB4
(OC2A/PCINT15) PB7
(T1/SEG24) PG3
(OC1B/PCINT14) PB6
(T0/SEG23) PG4
(OC1A/PCINT13) PB5
PC1 (SEG11)
PG0 (SEG14)
(SEG15) PD7
PC2 (SEG10)
PC3 (SEG9)
PC4 (SEG8)
PC5 (SEG7)
PC6 (SEG6)
PC7 (SEG5)
PA7 (SEG3)
PG2 (SEG4)
PA6 (SEG2)
PA5 (SEG1)
PA4 (SEG0)
PA3 (COM3)
PA0 (COM0) PA1 (COM1) PA2 (COM2)
PG1 (SEG13)
(SEG16) PD6 (SEG17) PD5
(SEG18) PD4 (SEG19) PD3
(SEG20) PD2
(INT0/SEG21) PD1
(ICP1/SEG22) PD0
(TOSC1) XTAL1 (TOSC2) XTAL2
RESET/PG5
GND
VCC
INDEX CORNER
(SS/PCINT8) PB0
2
3
1
4
5
6
7
8
9
10
11
12
13
14
16
15
64 63 62
47
46
48
45
44
43
42
41
40
39
38
37
36
35
33
34
ATmega329/649