Datasheet
Table Of Contents
- Features
- 1. Pin Configurations
- 2. Overview
- 3. Resources
- 4. Data Retention
- 5. About Code Examples
- 6. Capacitive touch sensing
- 7. AVR CPU Core
- 8. AVR Memories
- 9. System Clock and Clock Options
- 10. Power Management and Sleep Modes
- 11. System Control and Reset
- 12. Interrupts
- 13. External Interrupts
- 13.1 Pin Change Interrupt Timing
- 13.2 Register Description
- 13.2.1 EICRA – External Interrupt Control Register A
- 13.2.2 EIMSK – External Interrupt Mask Register
- 13.2.3 EIFR – External Interrupt Flag Registe
- 13.2.4 PCMSK3 – Pin Change Mask Register 3(1)
- 13.2.5 PCMSK2 – Pin Change Mask Register 2(1)
- 13.2.6 PCMSK1 – Pin Change Mask Register 1
- 13.2.7 PCMSK0 – Pin Change Mask Register 0
- 14. I/O-Ports
- 14.1 Overview
- 14.2 Ports as General Digital I/O
- 14.3 Alternate Port Functions
- 14.4 Register Description
- 14.4.1 MCUCR – MCU Control Register
- 14.4.2 PORTA – Port A Data Register
- 14.4.3 DDRA – Port A Data Direction Register
- 14.4.4 PINA – Port A Input Pins Address
- 14.4.5 PORTB – Port B Data Register
- 14.4.6 DDRB – Port B Data Direction Register
- 14.4.7 PINB – Port B Input Pins Address
- 14.4.8 PORTC – Port C Data Register
- 14.4.9 DDRC – Port C Data Direction Register
- 14.4.10 PINC – Port C Input Pins Address
- 14.4.11 PORTD – Port D Data Register
- 14.4.12 DDRD – Port D Data Direction Register
- 14.4.13 PIND – Port D Input Pins Address
- 14.4.14 PORTE – Port E Data Register
- 14.4.15 DDRE – Port E Data Direction Register
- 14.4.16 PINE – Port E Input Pins Address
- 14.4.17 PORTF – Port F Data Register
- 14.4.18 DDRF – Port F Data Direction Register
- 14.4.19 PINF – Port F Input Pins Address
- 14.4.20 PORTG – Port G Data Register
- 14.4.21 DDRG – Port G Data Direction Register
- 14.4.22 PING – Port G Input Pins Address
- 14.4.23 PORTH – Port H Data Register(1)
- 14.4.24 DDRH – Port H Data Direction Register(1)
- 14.4.25 PINH – Port H Input Pins Address(1)
- 14.4.26 PORTJ – Port J Data Register(1)
- 14.4.27 DDRJ – Port J Data Direction Register(1)
- 14.4.28 PINJ – Port J Input Pins Address(1)
- 15. 8-bit Timer/Counter0 with PWM
- 16. Timer/Counter0 and Timer/Counter1 Prescalers
- 17. 16-bit Timer/Counter1
- 17.1 Features
- 17.2 Overview
- 17.3 Accessing 16-bit Registers
- 17.4 Timer/Counter Clock Sources
- 17.5 Counter Unit
- 17.6 Input Capture Unit
- 17.7 Output Compare Units
- 17.8 Compare Match Output Unit
- 17.9 Modes of Operation
- 17.10 Timer/Counter Timing Diagrams
- 17.11 Register Description
- 17.11.1 TCCR1A – Timer/Counter1 Control Register A
- 17.11.2 TCCR1B – Timer/Counter1 Control Register B
- 17.11.3 TCCR1C – Timer/Counter1 Control Register C
- 17.11.4 TCNT1H and TCNT1L – Timer/Counter1
- 17.11.5 OCR1AH and OCR1AL – Output Compare Register 1 A
- 17.11.6 OCR1BH and OCR1BL – Output Compare Register 1 B
- 17.11.7 ICR1H and ICR1L – Input Capture Register 1
- 17.11.8 TIMSK1 – Timer/Counter1 Interrupt Mask Register
- 17.11.9 TIFR1 – Timer/Counter1 Interrupt Flag Register
- 18. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 18.1 Features
- 18.2 Overview
- 18.3 Timer/Counter Clock Sources
- 18.4 Counter Unit
- 18.5 Output Compare Unit
- 18.6 Compare Match Output Unit
- 18.7 Modes of Operation
- 18.8 Timer/Counter Timing Diagrams
- 18.9 Asynchronous Operation of Timer/Counter2
- 18.10 Timer/Counter Prescaler
- 18.11 Register Description
- 18.11.1 TCCR2A – Timer/Counter Control Register A
- 18.11.2 TCNT2 – Timer/Counter Register
- 18.11.3 OCR2A – Output Compare Register A
- 18.11.4 ASSR – Asynchronous Status Register
- 18.11.5 TIMSK2 – Timer/Counter2 Interrupt Mask Register
- 18.11.6 TIFR2 – Timer/Counter2 Interrupt Flag Register
- 18.11.7 GTCCR – General Timer/Counter Control Register
- 19. SPI – Serial Peripheral Interface
- 20. USART0
- 20.1 Features
- 20.2 Overview
- 20.3 Clock Generation
- 20.4 Frame Formats
- 20.5 USART Initialization
- 20.6 Data Transmission – The USART Transmitter
- 20.7 Data Reception – The USART Receiver
- 20.8 Asynchronous Data Reception
- 20.9 Multi-processor Communication Mode
- 20.10 Examples of Baud Rate Setting
- 20.11 Register Description
- 21. USI – Universal Serial Interface
- 22. Analog Comparator
- 23. Analog to Digital Converter
- 24. JTAG Interface and On-chip Debug System
- 25. IEEE 1149.1 (JTAG) Boundary-scan
- 26. Boot Loader Support – Read-While-Write Self-Programming
- 26.1 Features
- 26.2 Overview
- 26.3 Application and Boot Loader Flash Sections
- 26.4 Read-While-Write and No Read-While-Write Flash Sections
- 26.5 Boot Loader Lock Bits
- 26.6 Entering the Boot Loader Program
- 26.7 Addressing the Flash During Self-Programming
- 26.8 Self-Programming the Flash
- 26.8.1 Performing Page Erase by SPM
- 26.8.2 Filling the Temporary Buffer (Page Loading)
- 26.8.3 Performing a Page Write
- 26.8.4 Using the SPM Interrupt
- 26.8.5 Consideration While Updating BLS
- 26.8.6 Prevent Reading the RWW Section During Self-Programming
- 26.8.7 Setting the Boot Loader Lock Bits by SPM
- 26.8.8 EEPROM Write Prevents Writing to SPMCSR
- 26.8.9 Reading the Fuse and Lock Bits from Software
- 26.8.10 Preventing Flash Corruption
- 26.8.11 Programming Time for Flash when Using SPM
- 26.8.12 Simple Assembly Code Example for a Boot Loader
- 26.8.13 Atmel ATmega325/3250/645/6450 Boot Loader Parameters
- 26.9 Register Description
- 27. Memory Programming
- 27.1 Program And Data Memory Lock Bits
- 27.2 Fuse Bits
- 27.3 Signature Bytes
- 27.4 Calibration Byte
- 27.5 Parallel Programming Parameters, Pin Mapping, and Commands
- 27.6 Parallel Programming
- 27.6.1 Enter Programming Mode
- 27.6.2 Considerations for Efficient Programming
- 27.6.3 Chip Erase
- 27.6.4 Programming the Flash
- 27.6.5 Programming the EEPROM
- 27.6.6 Reading the Flash
- 27.6.7 Reading the EEPROM
- 27.6.8 Programming the Fuse Low Bits
- 27.6.9 Programming the Fuse High Bits
- 27.6.10 Programming the Extended Fuse Bits
- 27.6.11 Programming the Lock Bits
- 27.6.12 Reading the Fuse and Lock Bits
- 27.6.13 Reading the Signature Bytes
- 27.6.14 Reading the Calibration Byte
- 27.6.15 Parallel Programming Characteristics
- 27.7 Serial Downloading
- 27.8 Programming via the JTAG Interface
- 27.8.1 Programming Specific JTAG Instructions
- 27.8.2 AVR_RESET (0xC)
- 27.8.3 PROG_ENABLE (0x4)
- 27.8.4 PROG_COMMANDS (0x5)
- 27.8.5 PROG_PAGELOAD (0x6)
- 27.8.6 PROG_PAGEREAD (0x7)
- 27.8.7 Data Registers
- 27.8.8 Reset Register
- 27.8.9 Programming Enable Register
- 27.8.10 Programming Command Register
- 27.8.11 Flash Data Byte Register
- 27.8.12 Programming Algorithm
- 27.8.13 Entering Programming Mode
- 27.8.14 Leaving Programming Mode
- 27.8.15 Performing Chip Erase
- 27.8.16 Programming the Flash
- 27.8.17 Reading the Flash
- 27.8.18 Programming the EEPROM
- 27.8.19 Reading the EEPROM
- 27.8.20 Programming the Fuses
- 27.8.21 Programming the Lock Bits
- 27.8.22 Reading the Fuses and Lock Bits
- 27.8.23 Reading the Signature Bytes
- 27.8.24 Reading the Calibration Byte
- 28. Electrical Characteristics
- 29. Typical Characteristics
- 29.1 Active Supply Current
- 29.2 Idle Supply Current
- 29.3 Supply Current of I/O modules
- 29.4 Power-down Supply Current
- 29.5 Power-save Supply Current
- 29.6 Standby Supply Current
- 29.7 Pin Pull-up
- 29.8 Pin Driver Strength
- 29.9 Pin Thresholds and hysteresis
- 29.10 BOD Thresholds and Analog Comparator Offset
- 29.11 Internal Oscillator Speed
- 29.12 Current Consumption of Peripheral Units
- 29.13 Current Consumption in Reset and Reset Pulsewidth
- 30. Register Summary
- 31. Instruction Set Summary
- 32. Ordering Information
- 33. Packaging Information
- 34. Errata
- 35. Datasheet Revision History
- 35.1 Rev. 2570N – 05/11
- 35.2 Rev. 2570M – 04/11
- 35.3 Rev. 2570L – 08/07
- 35.4 Rev. 2570K – 04/07
- 35.5 Rev. 2570J – 11/06
- 35.6 Rev. 2570I – 07/06
- 35.7 Rev. 2570H – 06/06
- 35.8 Rev. 2570G – 04/06
- 35.9 Rev. 2570F – 03/06
- 35.10 Rev. 2570E – 03/06
- 35.11 Rev. 2570D – 05/05
- 35.12 Rev. 2570C – 11/04
- 35.13 Rev. 2570B – 09/04
- 35.14 Rev. 2570A – 09/04
- Table of Contents

279
2570N–AVR–05/11
ATmega325/3250/645/6450
Figure 27-9. Parallel Programming Timing, Reading Sequence (within the Same Page) with
Timing Requirements
(1)
Note: 1. The timing requirements shown in Figure 27-7 (i.e., t
DVXH
, t
XHXL
, and t
XLDX
) also apply to read-
ing operation.
Table 27-12. Parallel Programming Characteristics, V
CC
= 5V ± 10%
Symbol Parameter Min Typ Max Units
V
PP
Programming Enable Voltage 11.5 12.5 V
I
PP
Programming Enable Current 250 μA
t
DVXH
Data and Control Valid before XTAL1 High 67 ns
t
XLXH
XTAL1 Low to XTAL1 High 200 ns
t
XHXL
XTAL1 Pulse Width High 150 ns
t
XLDX
Data and Control Hold after XTAL1 Low 67 ns
t
XLWL
XTAL1 Low to WR Low 0 ns
t
XLPH
XTAL1 Low to PAGEL high 0 ns
t
PLXH
PAGEL low to XTAL1 high 150 ns
t
BVPH
BS1 Valid before PAGEL High 67 ns
t
PHPL
PAGEL Pulse Width High 150 ns
t
PLBX
BS1 Hold after PAGEL Low 67 ns
t
WLBX
BS2/1 Hold after WR Low 67 ns
t
PLWL
PAGEL Low to WR Low 67 ns
t
BVWL
BS1 Valid to WR Low 67 ns
t
WLWH
WR Pulse Width Low 150 ns
t
WLRL
WR Low to RDY/BSY Low 0 1 μs
t
WLRH
WR Low to RDY/BSY High
(1)
3.7 4.5 ms
t
WLRH_CE
WR Low to RDY/BSY High for Chip Erase
(2)
7.5 9 ms
t
XLOL
XTAL1 Low to OE Low 0 ns
XTAL1
OE
ADDR0 (Low Byte) DATA (Low Byte)
DATA (High Byte)
ADDR1 (Low Byte)
DATA
BS1
XA0
XA1
LOAD ADDRESS
(LOW BYTE)
READ DATA
(LOW BYTE)
READ DATA
(HIGH BYTE)
LOAD ADDRESS
(LOW BYTE)
t
BVDV
t
OLDV
t
XLOL
t
OHDZ