Datasheet
Table Of Contents
- Features
- 1. Pin Configurations
- 2. Overview
- 3. Resources
- 4. Data Retention
- 5. About Code Examples
- 6. Capacitive touch sensing
- 7. AVR CPU Core
- 8. AVR Memories
- 9. System Clock and Clock Options
- 10. Power Management and Sleep Modes
- 11. System Control and Reset
- 12. Interrupts
- 13. External Interrupts
- 13.1 Pin Change Interrupt Timing
- 13.2 Register Description
- 13.2.1 EICRA – External Interrupt Control Register A
- 13.2.2 EIMSK – External Interrupt Mask Register
- 13.2.3 EIFR – External Interrupt Flag Registe
- 13.2.4 PCMSK3 – Pin Change Mask Register 3(1)
- 13.2.5 PCMSK2 – Pin Change Mask Register 2(1)
- 13.2.6 PCMSK1 – Pin Change Mask Register 1
- 13.2.7 PCMSK0 – Pin Change Mask Register 0
- 14. I/O-Ports
- 14.1 Overview
- 14.2 Ports as General Digital I/O
- 14.3 Alternate Port Functions
- 14.4 Register Description
- 14.4.1 MCUCR – MCU Control Register
- 14.4.2 PORTA – Port A Data Register
- 14.4.3 DDRA – Port A Data Direction Register
- 14.4.4 PINA – Port A Input Pins Address
- 14.4.5 PORTB – Port B Data Register
- 14.4.6 DDRB – Port B Data Direction Register
- 14.4.7 PINB – Port B Input Pins Address
- 14.4.8 PORTC – Port C Data Register
- 14.4.9 DDRC – Port C Data Direction Register
- 14.4.10 PINC – Port C Input Pins Address
- 14.4.11 PORTD – Port D Data Register
- 14.4.12 DDRD – Port D Data Direction Register
- 14.4.13 PIND – Port D Input Pins Address
- 14.4.14 PORTE – Port E Data Register
- 14.4.15 DDRE – Port E Data Direction Register
- 14.4.16 PINE – Port E Input Pins Address
- 14.4.17 PORTF – Port F Data Register
- 14.4.18 DDRF – Port F Data Direction Register
- 14.4.19 PINF – Port F Input Pins Address
- 14.4.20 PORTG – Port G Data Register
- 14.4.21 DDRG – Port G Data Direction Register
- 14.4.22 PING – Port G Input Pins Address
- 14.4.23 PORTH – Port H Data Register(1)
- 14.4.24 DDRH – Port H Data Direction Register(1)
- 14.4.25 PINH – Port H Input Pins Address(1)
- 14.4.26 PORTJ – Port J Data Register(1)
- 14.4.27 DDRJ – Port J Data Direction Register(1)
- 14.4.28 PINJ – Port J Input Pins Address(1)
- 15. 8-bit Timer/Counter0 with PWM
- 16. Timer/Counter0 and Timer/Counter1 Prescalers
- 17. 16-bit Timer/Counter1
- 17.1 Features
- 17.2 Overview
- 17.3 Accessing 16-bit Registers
- 17.4 Timer/Counter Clock Sources
- 17.5 Counter Unit
- 17.6 Input Capture Unit
- 17.7 Output Compare Units
- 17.8 Compare Match Output Unit
- 17.9 Modes of Operation
- 17.10 Timer/Counter Timing Diagrams
- 17.11 Register Description
- 17.11.1 TCCR1A – Timer/Counter1 Control Register A
- 17.11.2 TCCR1B – Timer/Counter1 Control Register B
- 17.11.3 TCCR1C – Timer/Counter1 Control Register C
- 17.11.4 TCNT1H and TCNT1L – Timer/Counter1
- 17.11.5 OCR1AH and OCR1AL – Output Compare Register 1 A
- 17.11.6 OCR1BH and OCR1BL – Output Compare Register 1 B
- 17.11.7 ICR1H and ICR1L – Input Capture Register 1
- 17.11.8 TIMSK1 – Timer/Counter1 Interrupt Mask Register
- 17.11.9 TIFR1 – Timer/Counter1 Interrupt Flag Register
- 18. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 18.1 Features
- 18.2 Overview
- 18.3 Timer/Counter Clock Sources
- 18.4 Counter Unit
- 18.5 Output Compare Unit
- 18.6 Compare Match Output Unit
- 18.7 Modes of Operation
- 18.8 Timer/Counter Timing Diagrams
- 18.9 Asynchronous Operation of Timer/Counter2
- 18.10 Timer/Counter Prescaler
- 18.11 Register Description
- 18.11.1 TCCR2A – Timer/Counter Control Register A
- 18.11.2 TCNT2 – Timer/Counter Register
- 18.11.3 OCR2A – Output Compare Register A
- 18.11.4 ASSR – Asynchronous Status Register
- 18.11.5 TIMSK2 – Timer/Counter2 Interrupt Mask Register
- 18.11.6 TIFR2 – Timer/Counter2 Interrupt Flag Register
- 18.11.7 GTCCR – General Timer/Counter Control Register
- 19. SPI – Serial Peripheral Interface
- 20. USART0
- 20.1 Features
- 20.2 Overview
- 20.3 Clock Generation
- 20.4 Frame Formats
- 20.5 USART Initialization
- 20.6 Data Transmission – The USART Transmitter
- 20.7 Data Reception – The USART Receiver
- 20.8 Asynchronous Data Reception
- 20.9 Multi-processor Communication Mode
- 20.10 Examples of Baud Rate Setting
- 20.11 Register Description
- 21. USI – Universal Serial Interface
- 22. Analog Comparator
- 23. Analog to Digital Converter
- 24. JTAG Interface and On-chip Debug System
- 25. IEEE 1149.1 (JTAG) Boundary-scan
- 26. Boot Loader Support – Read-While-Write Self-Programming
- 26.1 Features
- 26.2 Overview
- 26.3 Application and Boot Loader Flash Sections
- 26.4 Read-While-Write and No Read-While-Write Flash Sections
- 26.5 Boot Loader Lock Bits
- 26.6 Entering the Boot Loader Program
- 26.7 Addressing the Flash During Self-Programming
- 26.8 Self-Programming the Flash
- 26.8.1 Performing Page Erase by SPM
- 26.8.2 Filling the Temporary Buffer (Page Loading)
- 26.8.3 Performing a Page Write
- 26.8.4 Using the SPM Interrupt
- 26.8.5 Consideration While Updating BLS
- 26.8.6 Prevent Reading the RWW Section During Self-Programming
- 26.8.7 Setting the Boot Loader Lock Bits by SPM
- 26.8.8 EEPROM Write Prevents Writing to SPMCSR
- 26.8.9 Reading the Fuse and Lock Bits from Software
- 26.8.10 Preventing Flash Corruption
- 26.8.11 Programming Time for Flash when Using SPM
- 26.8.12 Simple Assembly Code Example for a Boot Loader
- 26.8.13 Atmel ATmega325/3250/645/6450 Boot Loader Parameters
- 26.9 Register Description
- 27. Memory Programming
- 27.1 Program And Data Memory Lock Bits
- 27.2 Fuse Bits
- 27.3 Signature Bytes
- 27.4 Calibration Byte
- 27.5 Parallel Programming Parameters, Pin Mapping, and Commands
- 27.6 Parallel Programming
- 27.6.1 Enter Programming Mode
- 27.6.2 Considerations for Efficient Programming
- 27.6.3 Chip Erase
- 27.6.4 Programming the Flash
- 27.6.5 Programming the EEPROM
- 27.6.6 Reading the Flash
- 27.6.7 Reading the EEPROM
- 27.6.8 Programming the Fuse Low Bits
- 27.6.9 Programming the Fuse High Bits
- 27.6.10 Programming the Extended Fuse Bits
- 27.6.11 Programming the Lock Bits
- 27.6.12 Reading the Fuse and Lock Bits
- 27.6.13 Reading the Signature Bytes
- 27.6.14 Reading the Calibration Byte
- 27.6.15 Parallel Programming Characteristics
- 27.7 Serial Downloading
- 27.8 Programming via the JTAG Interface
- 27.8.1 Programming Specific JTAG Instructions
- 27.8.2 AVR_RESET (0xC)
- 27.8.3 PROG_ENABLE (0x4)
- 27.8.4 PROG_COMMANDS (0x5)
- 27.8.5 PROG_PAGELOAD (0x6)
- 27.8.6 PROG_PAGEREAD (0x7)
- 27.8.7 Data Registers
- 27.8.8 Reset Register
- 27.8.9 Programming Enable Register
- 27.8.10 Programming Command Register
- 27.8.11 Flash Data Byte Register
- 27.8.12 Programming Algorithm
- 27.8.13 Entering Programming Mode
- 27.8.14 Leaving Programming Mode
- 27.8.15 Performing Chip Erase
- 27.8.16 Programming the Flash
- 27.8.17 Reading the Flash
- 27.8.18 Programming the EEPROM
- 27.8.19 Reading the EEPROM
- 27.8.20 Programming the Fuses
- 27.8.21 Programming the Lock Bits
- 27.8.22 Reading the Fuses and Lock Bits
- 27.8.23 Reading the Signature Bytes
- 27.8.24 Reading the Calibration Byte
- 28. Electrical Characteristics
- 29. Typical Characteristics
- 29.1 Active Supply Current
- 29.2 Idle Supply Current
- 29.3 Supply Current of I/O modules
- 29.4 Power-down Supply Current
- 29.5 Power-save Supply Current
- 29.6 Standby Supply Current
- 29.7 Pin Pull-up
- 29.8 Pin Driver Strength
- 29.9 Pin Thresholds and hysteresis
- 29.10 BOD Thresholds and Analog Comparator Offset
- 29.11 Internal Oscillator Speed
- 29.12 Current Consumption of Peripheral Units
- 29.13 Current Consumption in Reset and Reset Pulsewidth
- 30. Register Summary
- 31. Instruction Set Summary
- 32. Ordering Information
- 33. Packaging Information
- 34. Errata
- 35. Datasheet Revision History
- 35.1 Rev. 2570N – 05/11
- 35.2 Rev. 2570M – 04/11
- 35.3 Rev. 2570L – 08/07
- 35.4 Rev. 2570K – 04/07
- 35.5 Rev. 2570J – 11/06
- 35.6 Rev. 2570I – 07/06
- 35.7 Rev. 2570H – 06/06
- 35.8 Rev. 2570G – 04/06
- 35.9 Rev. 2570F – 03/06
- 35.10 Rev. 2570E – 03/06
- 35.11 Rev. 2570D – 05/05
- 35.12 Rev. 2570C – 11/04
- 35.13 Rev. 2570B – 09/04
- 35.14 Rev. 2570A – 09/04
- Table of Contents
259
2570N–AVR–05/11
ATmega325/3250/645/6450
26.8.9 Reading the Fuse and Lock Bits from Software
It is possible to read both the Fuse and Lock bits from software. To read the Lock bits, load the
Z-pointer with 0x0001 and set the BLBSET and SPMEN bits in SPMCSR. When an LPM instruc-
tion is executed within three CPU cycles after the BLBSET and SPMEN bits are set in SPMCSR,
the value of the Lock bits will be loaded in the destination register. The BLBSET and SPMEN
bits will auto-clear upon completion of reading the Lock bits or if no LPM instruction is executed
within three CPU cycles or no SPM instruction is executed within four CPU cycles. When BLB-
SET and SPMEN are cleared, LPM will work as described in the Instruction set Manual.
The algorithm for reading the Fuse Low byte is similar to the one described above for reading
the Lock bits. To read the Fuse Low byte, load the Z-pointer with 0x0000 and set the BLBSET
and SPMEN bits in SPMCSR. When an LPM instruction is executed within three cycles after the
BLBSET and SPMEN bits are set in the SPMCSR, the value of the Fuse Low byte (FLB) will be
loaded in the destination register as shown below. Refer to Table 27-5 on page 267 for a
detailed description and mapping of the Fuse Low byte.
Similarly, when reading the Fuse High byte, load 0x0003 in the Z-pointer. When an LPM instruc-
tion is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR,
the value of the Fuse High byte (FHB) will be loaded in the destination register as shown below.
Refer to Table 27-4 on page 267 for detailed description and mapping of the Fuse High byte.
When reading the Extended Fuse byte, load 0x0002 in the Z-pointer. When an LPM instruction
is executed within three cycles after the BLBSET and SPMEN bits are set in the SPMCSR, the
value of the Extended Fuse byte (EFB) will be loaded in the destination register as shown below.
Refer to Table 27-3 on page 266 for detailed description and mapping of the Extended Fuse
byte.
Fuse and Lock bits that are programmed, will be read as zero. Fuse and Lock bits that are
unprogrammed, will be read as one.
26.8.10 Preventing Flash Corruption
During periods of low V
CC
, the Flash program can be corrupted because the supply voltage is
too low for the CPU and the Flash to operate properly. These issues are the same as for board
level systems using the Flash, and the same design solutions should be applied.
A Flash program corruption can be caused by two situations when the voltage is too low. First, a
regular write sequence to the Flash requires a minimum voltage to operate correctly. Secondly,
the CPU itself can execute instructions incorrectly, if the supply voltage for executing instructions
is too low.
Flash corruption can easily be avoided by following these design recommendations (one is
sufficient):
Bit 76543210
Rd – – BLB12 BLB11 BLB02 BLB01 LB2 LB1
Bit 76543210
Rd FLB7 FLB6 FLB5 FLB4 FLB3 FLB2 FLB1 FLB0
Bit 76543210
Rd FHB7 FHB6 FHB5 FHB4 FHB3 FHB2 FHB1 FHB0
Bit 76543210
Rd – – – – – EFB2EFB1EFB0