Datasheet
Table Of Contents
- Features
- 1. Pin Configurations
- 2. Overview
- 3. Resources
- 4. Data Retention
- 5. About Code Examples
- 6. Capacitive touch sensing
- 7. AVR CPU Core
- 8. AVR Memories
- 9. System Clock and Clock Options
- 10. Power Management and Sleep Modes
- 11. System Control and Reset
- 12. Interrupts
- 13. External Interrupts
- 13.1 Pin Change Interrupt Timing
- 13.2 Register Description
- 13.2.1 EICRA – External Interrupt Control Register A
- 13.2.2 EIMSK – External Interrupt Mask Register
- 13.2.3 EIFR – External Interrupt Flag Registe
- 13.2.4 PCMSK3 – Pin Change Mask Register 3(1)
- 13.2.5 PCMSK2 – Pin Change Mask Register 2(1)
- 13.2.6 PCMSK1 – Pin Change Mask Register 1
- 13.2.7 PCMSK0 – Pin Change Mask Register 0
- 14. I/O-Ports
- 14.1 Overview
- 14.2 Ports as General Digital I/O
- 14.3 Alternate Port Functions
- 14.4 Register Description
- 14.4.1 MCUCR – MCU Control Register
- 14.4.2 PORTA – Port A Data Register
- 14.4.3 DDRA – Port A Data Direction Register
- 14.4.4 PINA – Port A Input Pins Address
- 14.4.5 PORTB – Port B Data Register
- 14.4.6 DDRB – Port B Data Direction Register
- 14.4.7 PINB – Port B Input Pins Address
- 14.4.8 PORTC – Port C Data Register
- 14.4.9 DDRC – Port C Data Direction Register
- 14.4.10 PINC – Port C Input Pins Address
- 14.4.11 PORTD – Port D Data Register
- 14.4.12 DDRD – Port D Data Direction Register
- 14.4.13 PIND – Port D Input Pins Address
- 14.4.14 PORTE – Port E Data Register
- 14.4.15 DDRE – Port E Data Direction Register
- 14.4.16 PINE – Port E Input Pins Address
- 14.4.17 PORTF – Port F Data Register
- 14.4.18 DDRF – Port F Data Direction Register
- 14.4.19 PINF – Port F Input Pins Address
- 14.4.20 PORTG – Port G Data Register
- 14.4.21 DDRG – Port G Data Direction Register
- 14.4.22 PING – Port G Input Pins Address
- 14.4.23 PORTH – Port H Data Register(1)
- 14.4.24 DDRH – Port H Data Direction Register(1)
- 14.4.25 PINH – Port H Input Pins Address(1)
- 14.4.26 PORTJ – Port J Data Register(1)
- 14.4.27 DDRJ – Port J Data Direction Register(1)
- 14.4.28 PINJ – Port J Input Pins Address(1)
- 15. 8-bit Timer/Counter0 with PWM
- 16. Timer/Counter0 and Timer/Counter1 Prescalers
- 17. 16-bit Timer/Counter1
- 17.1 Features
- 17.2 Overview
- 17.3 Accessing 16-bit Registers
- 17.4 Timer/Counter Clock Sources
- 17.5 Counter Unit
- 17.6 Input Capture Unit
- 17.7 Output Compare Units
- 17.8 Compare Match Output Unit
- 17.9 Modes of Operation
- 17.10 Timer/Counter Timing Diagrams
- 17.11 Register Description
- 17.11.1 TCCR1A – Timer/Counter1 Control Register A
- 17.11.2 TCCR1B – Timer/Counter1 Control Register B
- 17.11.3 TCCR1C – Timer/Counter1 Control Register C
- 17.11.4 TCNT1H and TCNT1L – Timer/Counter1
- 17.11.5 OCR1AH and OCR1AL – Output Compare Register 1 A
- 17.11.6 OCR1BH and OCR1BL – Output Compare Register 1 B
- 17.11.7 ICR1H and ICR1L – Input Capture Register 1
- 17.11.8 TIMSK1 – Timer/Counter1 Interrupt Mask Register
- 17.11.9 TIFR1 – Timer/Counter1 Interrupt Flag Register
- 18. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 18.1 Features
- 18.2 Overview
- 18.3 Timer/Counter Clock Sources
- 18.4 Counter Unit
- 18.5 Output Compare Unit
- 18.6 Compare Match Output Unit
- 18.7 Modes of Operation
- 18.8 Timer/Counter Timing Diagrams
- 18.9 Asynchronous Operation of Timer/Counter2
- 18.10 Timer/Counter Prescaler
- 18.11 Register Description
- 18.11.1 TCCR2A – Timer/Counter Control Register A
- 18.11.2 TCNT2 – Timer/Counter Register
- 18.11.3 OCR2A – Output Compare Register A
- 18.11.4 ASSR – Asynchronous Status Register
- 18.11.5 TIMSK2 – Timer/Counter2 Interrupt Mask Register
- 18.11.6 TIFR2 – Timer/Counter2 Interrupt Flag Register
- 18.11.7 GTCCR – General Timer/Counter Control Register
- 19. SPI – Serial Peripheral Interface
- 20. USART0
- 20.1 Features
- 20.2 Overview
- 20.3 Clock Generation
- 20.4 Frame Formats
- 20.5 USART Initialization
- 20.6 Data Transmission – The USART Transmitter
- 20.7 Data Reception – The USART Receiver
- 20.8 Asynchronous Data Reception
- 20.9 Multi-processor Communication Mode
- 20.10 Examples of Baud Rate Setting
- 20.11 Register Description
- 21. USI – Universal Serial Interface
- 22. Analog Comparator
- 23. Analog to Digital Converter
- 24. JTAG Interface and On-chip Debug System
- 25. IEEE 1149.1 (JTAG) Boundary-scan
- 26. Boot Loader Support – Read-While-Write Self-Programming
- 26.1 Features
- 26.2 Overview
- 26.3 Application and Boot Loader Flash Sections
- 26.4 Read-While-Write and No Read-While-Write Flash Sections
- 26.5 Boot Loader Lock Bits
- 26.6 Entering the Boot Loader Program
- 26.7 Addressing the Flash During Self-Programming
- 26.8 Self-Programming the Flash
- 26.8.1 Performing Page Erase by SPM
- 26.8.2 Filling the Temporary Buffer (Page Loading)
- 26.8.3 Performing a Page Write
- 26.8.4 Using the SPM Interrupt
- 26.8.5 Consideration While Updating BLS
- 26.8.6 Prevent Reading the RWW Section During Self-Programming
- 26.8.7 Setting the Boot Loader Lock Bits by SPM
- 26.8.8 EEPROM Write Prevents Writing to SPMCSR
- 26.8.9 Reading the Fuse and Lock Bits from Software
- 26.8.10 Preventing Flash Corruption
- 26.8.11 Programming Time for Flash when Using SPM
- 26.8.12 Simple Assembly Code Example for a Boot Loader
- 26.8.13 Atmel ATmega325/3250/645/6450 Boot Loader Parameters
- 26.9 Register Description
- 27. Memory Programming
- 27.1 Program And Data Memory Lock Bits
- 27.2 Fuse Bits
- 27.3 Signature Bytes
- 27.4 Calibration Byte
- 27.5 Parallel Programming Parameters, Pin Mapping, and Commands
- 27.6 Parallel Programming
- 27.6.1 Enter Programming Mode
- 27.6.2 Considerations for Efficient Programming
- 27.6.3 Chip Erase
- 27.6.4 Programming the Flash
- 27.6.5 Programming the EEPROM
- 27.6.6 Reading the Flash
- 27.6.7 Reading the EEPROM
- 27.6.8 Programming the Fuse Low Bits
- 27.6.9 Programming the Fuse High Bits
- 27.6.10 Programming the Extended Fuse Bits
- 27.6.11 Programming the Lock Bits
- 27.6.12 Reading the Fuse and Lock Bits
- 27.6.13 Reading the Signature Bytes
- 27.6.14 Reading the Calibration Byte
- 27.6.15 Parallel Programming Characteristics
- 27.7 Serial Downloading
- 27.8 Programming via the JTAG Interface
- 27.8.1 Programming Specific JTAG Instructions
- 27.8.2 AVR_RESET (0xC)
- 27.8.3 PROG_ENABLE (0x4)
- 27.8.4 PROG_COMMANDS (0x5)
- 27.8.5 PROG_PAGELOAD (0x6)
- 27.8.6 PROG_PAGEREAD (0x7)
- 27.8.7 Data Registers
- 27.8.8 Reset Register
- 27.8.9 Programming Enable Register
- 27.8.10 Programming Command Register
- 27.8.11 Flash Data Byte Register
- 27.8.12 Programming Algorithm
- 27.8.13 Entering Programming Mode
- 27.8.14 Leaving Programming Mode
- 27.8.15 Performing Chip Erase
- 27.8.16 Programming the Flash
- 27.8.17 Reading the Flash
- 27.8.18 Programming the EEPROM
- 27.8.19 Reading the EEPROM
- 27.8.20 Programming the Fuses
- 27.8.21 Programming the Lock Bits
- 27.8.22 Reading the Fuses and Lock Bits
- 27.8.23 Reading the Signature Bytes
- 27.8.24 Reading the Calibration Byte
- 28. Electrical Characteristics
- 29. Typical Characteristics
- 29.1 Active Supply Current
- 29.2 Idle Supply Current
- 29.3 Supply Current of I/O modules
- 29.4 Power-down Supply Current
- 29.5 Power-save Supply Current
- 29.6 Standby Supply Current
- 29.7 Pin Pull-up
- 29.8 Pin Driver Strength
- 29.9 Pin Thresholds and hysteresis
- 29.10 BOD Thresholds and Analog Comparator Offset
- 29.11 Internal Oscillator Speed
- 29.12 Current Consumption of Peripheral Units
- 29.13 Current Consumption in Reset and Reset Pulsewidth
- 30. Register Summary
- 31. Instruction Set Summary
- 32. Ordering Information
- 33. Packaging Information
- 34. Errata
- 35. Datasheet Revision History
- 35.1 Rev. 2570N – 05/11
- 35.2 Rev. 2570M – 04/11
- 35.3 Rev. 2570L – 08/07
- 35.4 Rev. 2570K – 04/07
- 35.5 Rev. 2570J – 11/06
- 35.6 Rev. 2570I – 07/06
- 35.7 Rev. 2570H – 06/06
- 35.8 Rev. 2570G – 04/06
- 35.9 Rev. 2570F – 03/06
- 35.10 Rev. 2570E – 03/06
- 35.11 Rev. 2570D – 05/05
- 35.12 Rev. 2570C – 11/04
- 35.13 Rev. 2570B – 09/04
- 35.14 Rev. 2570A – 09/04
- Table of Contents
207
2570N–AVR–05/11
ATmega325/3250/645/6450
23.5.1 ADC Input Channels
When changing channel selections, the user should observe the following guidelines to ensure
that the correct channel is selected:
In Single Conversion mode, always select the channel before starting the conversion. The chan-
nel selection may be changed one ADC clock cycle after writing one to ADSC. However, the
simplest method is to wait for the conversion to complete before changing the channel selection.
In Free Running mode, always select the channel before starting the first conversion. The chan-
nel selection may be changed one ADC clock cycle after writing one to ADSC. However, the
simplest method is to wait for the first conversion to complete, and then change the channel
selection. Since the next conversion has already started automatically, the next result will reflect
the previous channel selection. Subsequent conversions will reflect the new channel selection.
23.5.2 ADC Voltage Reference
The reference voltage for the ADC (V
REF
) indicates the conversion range for the ADC. Single
ended channels that exceed V
REF
will result in codes close to 0x3FF. V
REF
can be selected as
either AVCC, internal 1.1V reference, or external AREF pin.
AVCC is connected to the ADC through a passive switch. The internal 1.1V reference is gener-
ated from the internal bandgap reference (V
BG
) through an internal buffer. In either case, the
external AREF pin is directly connected to the ADC, and the reference voltage can be made
more immune to noise by connecting a capacitor between the AREF pin and ground. V
REF
can
also be measured at the AREF pin with a high impedant voltmeter. Note that V
REF
is a high
impedant source, and only a capacitive load should be connected in a system.
If the user has a fixed voltage source connected to the AREF pin, the user may not use the other
reference voltage options in the application, as they will be shorted to the external voltage. If no
external voltage is applied to the AREF pin, the user may switch between AVCC and 1.1V as
reference selection. The first ADC conversion result after switching reference voltage source
may be inaccurate, and the user is advised to discard this result.
23.6 ADC Noise Canceler
The ADC features a noise canceler that enables conversion during sleep mode to reduce noise
induced from the CPU core and other I/O peripherals. The noise canceler can be used with ADC
Noise Reduction and Idle mode. To make use of this feature, the following procedure should be
used:
1. Make sure that the ADC is enabled and is not busy converting. Single Conversion
mode must be selected and the ADC conversion complete interrupt must be
enabled.
2. Enter ADC Noise Reduction mode (or Idle mode). The ADC will start a conversion
once the CPU has been halted.
3. If no other interrupts occur before the ADC conversion completes, the ADC interrupt
will wake up the CPU and execute the ADC Conversion Complete interrupt routine. If
another interrupt wakes up the CPU before the ADC conversion is complete, that
interrupt will be executed, and an ADC Conversion Complete interrupt request will be
generated when the ADC conversion completes. The CPU will remain in active mode
until a new sleep command is executed.
Note that the ADC will not be automatically turned off when entering other sleep modes than Idle
mode and ADC Noise Reduction mode. The user is advised to write zero to ADEN before enter-
ing such sleep modes to avoid excessive power consumption.