Datasheet

Table Of Contents
3
2570N–AVR–05/11
ATmega325/3250/645/6450
Figure 1-2. Pinout ATmega325/645
Note: The large center pad underneath the QFN/MLF packages is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
PC0
VCC
GND
PF0 (ADC0)
PF7 (ADC7/TDI)
PF1 (ADC1)
PF2 (ADC2)
PF3 (ADC3)
PF4 (ADC4/TCK)
PF5 (ADC5/TMS)
PF6 (ADC6/TDO)
AREF
GND
AVCC
17
61
60
18
59
20
58
19
21
57
22
56
23
55
24
54
25
53
26
52
27
51
29
28
50
49
32
31
30
(RXD/PCINT0) PE0
(TXD/PCINT1) PE1
(XCK/AIN0/PCINT2) PE2
(AIN1/PCINT3) PE3
(USCK/SCL/PCINT4) PE4
(DI/SDA/PCINT5) PE5
(DO/PCINT6) PE6
(CLKO/PCINT7) PE7
(SCK/PCINT9) PB1
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(OC0A/PCINT12) PB4
(OC2A/PCINT15) PB7
(T1) PG3
(OC1B/PCINT14) PB6
(T0) PG4
(OC1A/PCINT13) PB5
PC1
PG0
PD7
PC2
PC3
PC4
PC5
PC6
PC7
PA7
PG2
PA6
PA5
PA4
PA3
PA0
PA1
PA2
PG1
PD6
PD5
PD4
PD3
PD2
PD1 (INT0)
(ICP1) PD0
XTAL1 (TOSC1)
XTAL2 (TOSC2)
RESET/PG5
GND
VCC
INDEX CORNER
(SS/PCINT8) PB0
2
3
1
4
5
6
7
8
9
10
11
12
13
14
16
15
64
63
62
47
46
48
45
44
43
42
41
40
39
38
37
36
35
33
34
ATmega325/645
DNC