Datasheet
Table Of Contents
- Features
- 1. Pin Configurations
- 2. Overview
- 3. Resources
- 4. Data Retention
- 5. About Code Examples
- 6. Capacitive touch sensing
- 7. AVR CPU Core
- 8. AVR Memories
- 9. System Clock and Clock Options
- 10. Power Management and Sleep Modes
- 11. System Control and Reset
- 12. Interrupts
- 13. External Interrupts
- 13.1 Pin Change Interrupt Timing
- 13.2 Register Description
- 13.2.1 EICRA – External Interrupt Control Register A
- 13.2.2 EIMSK – External Interrupt Mask Register
- 13.2.3 EIFR – External Interrupt Flag Registe
- 13.2.4 PCMSK3 – Pin Change Mask Register 3(1)
- 13.2.5 PCMSK2 – Pin Change Mask Register 2(1)
- 13.2.6 PCMSK1 – Pin Change Mask Register 1
- 13.2.7 PCMSK0 – Pin Change Mask Register 0
- 14. I/O-Ports
- 14.1 Overview
- 14.2 Ports as General Digital I/O
- 14.3 Alternate Port Functions
- 14.4 Register Description
- 14.4.1 MCUCR – MCU Control Register
- 14.4.2 PORTA – Port A Data Register
- 14.4.3 DDRA – Port A Data Direction Register
- 14.4.4 PINA – Port A Input Pins Address
- 14.4.5 PORTB – Port B Data Register
- 14.4.6 DDRB – Port B Data Direction Register
- 14.4.7 PINB – Port B Input Pins Address
- 14.4.8 PORTC – Port C Data Register
- 14.4.9 DDRC – Port C Data Direction Register
- 14.4.10 PINC – Port C Input Pins Address
- 14.4.11 PORTD – Port D Data Register
- 14.4.12 DDRD – Port D Data Direction Register
- 14.4.13 PIND – Port D Input Pins Address
- 14.4.14 PORTE – Port E Data Register
- 14.4.15 DDRE – Port E Data Direction Register
- 14.4.16 PINE – Port E Input Pins Address
- 14.4.17 PORTF – Port F Data Register
- 14.4.18 DDRF – Port F Data Direction Register
- 14.4.19 PINF – Port F Input Pins Address
- 14.4.20 PORTG – Port G Data Register
- 14.4.21 DDRG – Port G Data Direction Register
- 14.4.22 PING – Port G Input Pins Address
- 14.4.23 PORTH – Port H Data Register(1)
- 14.4.24 DDRH – Port H Data Direction Register(1)
- 14.4.25 PINH – Port H Input Pins Address(1)
- 14.4.26 PORTJ – Port J Data Register(1)
- 14.4.27 DDRJ – Port J Data Direction Register(1)
- 14.4.28 PINJ – Port J Input Pins Address(1)
- 15. 8-bit Timer/Counter0 with PWM
- 16. Timer/Counter0 and Timer/Counter1 Prescalers
- 17. 16-bit Timer/Counter1
- 17.1 Features
- 17.2 Overview
- 17.3 Accessing 16-bit Registers
- 17.4 Timer/Counter Clock Sources
- 17.5 Counter Unit
- 17.6 Input Capture Unit
- 17.7 Output Compare Units
- 17.8 Compare Match Output Unit
- 17.9 Modes of Operation
- 17.10 Timer/Counter Timing Diagrams
- 17.11 Register Description
- 17.11.1 TCCR1A – Timer/Counter1 Control Register A
- 17.11.2 TCCR1B – Timer/Counter1 Control Register B
- 17.11.3 TCCR1C – Timer/Counter1 Control Register C
- 17.11.4 TCNT1H and TCNT1L – Timer/Counter1
- 17.11.5 OCR1AH and OCR1AL – Output Compare Register 1 A
- 17.11.6 OCR1BH and OCR1BL – Output Compare Register 1 B
- 17.11.7 ICR1H and ICR1L – Input Capture Register 1
- 17.11.8 TIMSK1 – Timer/Counter1 Interrupt Mask Register
- 17.11.9 TIFR1 – Timer/Counter1 Interrupt Flag Register
- 18. 8-bit Timer/Counter2 with PWM and Asynchronous Operation
- 18.1 Features
- 18.2 Overview
- 18.3 Timer/Counter Clock Sources
- 18.4 Counter Unit
- 18.5 Output Compare Unit
- 18.6 Compare Match Output Unit
- 18.7 Modes of Operation
- 18.8 Timer/Counter Timing Diagrams
- 18.9 Asynchronous Operation of Timer/Counter2
- 18.10 Timer/Counter Prescaler
- 18.11 Register Description
- 18.11.1 TCCR2A – Timer/Counter Control Register A
- 18.11.2 TCNT2 – Timer/Counter Register
- 18.11.3 OCR2A – Output Compare Register A
- 18.11.4 ASSR – Asynchronous Status Register
- 18.11.5 TIMSK2 – Timer/Counter2 Interrupt Mask Register
- 18.11.6 TIFR2 – Timer/Counter2 Interrupt Flag Register
- 18.11.7 GTCCR – General Timer/Counter Control Register
- 19. SPI – Serial Peripheral Interface
- 20. USART0
- 20.1 Features
- 20.2 Overview
- 20.3 Clock Generation
- 20.4 Frame Formats
- 20.5 USART Initialization
- 20.6 Data Transmission – The USART Transmitter
- 20.7 Data Reception – The USART Receiver
- 20.8 Asynchronous Data Reception
- 20.9 Multi-processor Communication Mode
- 20.10 Examples of Baud Rate Setting
- 20.11 Register Description
- 21. USI – Universal Serial Interface
- 22. Analog Comparator
- 23. Analog to Digital Converter
- 24. JTAG Interface and On-chip Debug System
- 25. IEEE 1149.1 (JTAG) Boundary-scan
- 26. Boot Loader Support – Read-While-Write Self-Programming
- 26.1 Features
- 26.2 Overview
- 26.3 Application and Boot Loader Flash Sections
- 26.4 Read-While-Write and No Read-While-Write Flash Sections
- 26.5 Boot Loader Lock Bits
- 26.6 Entering the Boot Loader Program
- 26.7 Addressing the Flash During Self-Programming
- 26.8 Self-Programming the Flash
- 26.8.1 Performing Page Erase by SPM
- 26.8.2 Filling the Temporary Buffer (Page Loading)
- 26.8.3 Performing a Page Write
- 26.8.4 Using the SPM Interrupt
- 26.8.5 Consideration While Updating BLS
- 26.8.6 Prevent Reading the RWW Section During Self-Programming
- 26.8.7 Setting the Boot Loader Lock Bits by SPM
- 26.8.8 EEPROM Write Prevents Writing to SPMCSR
- 26.8.9 Reading the Fuse and Lock Bits from Software
- 26.8.10 Preventing Flash Corruption
- 26.8.11 Programming Time for Flash when Using SPM
- 26.8.12 Simple Assembly Code Example for a Boot Loader
- 26.8.13 Atmel ATmega325/3250/645/6450 Boot Loader Parameters
- 26.9 Register Description
- 27. Memory Programming
- 27.1 Program And Data Memory Lock Bits
- 27.2 Fuse Bits
- 27.3 Signature Bytes
- 27.4 Calibration Byte
- 27.5 Parallel Programming Parameters, Pin Mapping, and Commands
- 27.6 Parallel Programming
- 27.6.1 Enter Programming Mode
- 27.6.2 Considerations for Efficient Programming
- 27.6.3 Chip Erase
- 27.6.4 Programming the Flash
- 27.6.5 Programming the EEPROM
- 27.6.6 Reading the Flash
- 27.6.7 Reading the EEPROM
- 27.6.8 Programming the Fuse Low Bits
- 27.6.9 Programming the Fuse High Bits
- 27.6.10 Programming the Extended Fuse Bits
- 27.6.11 Programming the Lock Bits
- 27.6.12 Reading the Fuse and Lock Bits
- 27.6.13 Reading the Signature Bytes
- 27.6.14 Reading the Calibration Byte
- 27.6.15 Parallel Programming Characteristics
- 27.7 Serial Downloading
- 27.8 Programming via the JTAG Interface
- 27.8.1 Programming Specific JTAG Instructions
- 27.8.2 AVR_RESET (0xC)
- 27.8.3 PROG_ENABLE (0x4)
- 27.8.4 PROG_COMMANDS (0x5)
- 27.8.5 PROG_PAGELOAD (0x6)
- 27.8.6 PROG_PAGEREAD (0x7)
- 27.8.7 Data Registers
- 27.8.8 Reset Register
- 27.8.9 Programming Enable Register
- 27.8.10 Programming Command Register
- 27.8.11 Flash Data Byte Register
- 27.8.12 Programming Algorithm
- 27.8.13 Entering Programming Mode
- 27.8.14 Leaving Programming Mode
- 27.8.15 Performing Chip Erase
- 27.8.16 Programming the Flash
- 27.8.17 Reading the Flash
- 27.8.18 Programming the EEPROM
- 27.8.19 Reading the EEPROM
- 27.8.20 Programming the Fuses
- 27.8.21 Programming the Lock Bits
- 27.8.22 Reading the Fuses and Lock Bits
- 27.8.23 Reading the Signature Bytes
- 27.8.24 Reading the Calibration Byte
- 28. Electrical Characteristics
- 29. Typical Characteristics
- 29.1 Active Supply Current
- 29.2 Idle Supply Current
- 29.3 Supply Current of I/O modules
- 29.4 Power-down Supply Current
- 29.5 Power-save Supply Current
- 29.6 Standby Supply Current
- 29.7 Pin Pull-up
- 29.8 Pin Driver Strength
- 29.9 Pin Thresholds and hysteresis
- 29.10 BOD Thresholds and Analog Comparator Offset
- 29.11 Internal Oscillator Speed
- 29.12 Current Consumption of Peripheral Units
- 29.13 Current Consumption in Reset and Reset Pulsewidth
- 30. Register Summary
- 31. Instruction Set Summary
- 32. Ordering Information
- 33. Packaging Information
- 34. Errata
- 35. Datasheet Revision History
- 35.1 Rev. 2570N – 05/11
- 35.2 Rev. 2570M – 04/11
- 35.3 Rev. 2570L – 08/07
- 35.4 Rev. 2570K – 04/07
- 35.5 Rev. 2570J – 11/06
- 35.6 Rev. 2570I – 07/06
- 35.7 Rev. 2570H – 06/06
- 35.8 Rev. 2570G – 04/06
- 35.9 Rev. 2570F – 03/06
- 35.10 Rev. 2570E – 03/06
- 35.11 Rev. 2570D – 05/05
- 35.12 Rev. 2570C – 11/04
- 35.13 Rev. 2570B – 09/04
- 35.14 Rev. 2570A – 09/04
- Table of Contents
28
2570N–AVR–05/11
ATmega325/3250/645/6450
9.3 Crystal Oscillator
XTAL1 and XTAL2 are input and output, respectively, of an inverting amplifier which can be con-
figured for use as an On-chip Oscillator, as shown in Figure 9-2 on page 28. Either a quartz
crystal or a ceramic resonator may be used.
C1 and C2 should always be equal for both crystals and resonators. The optimal value of the
capacitors depends on the crystal or resonator in use, the amount of stray capacitance, and the
electromagnetic noise of the environment. Some initial guidelines for choosing capacitors for
use with crystals are given in Table 9-3 on page 28. For ceramic resonators, the capacitor val-
ues given by the manufacturer should be used.
Figure 9-2. Crystal Oscillator Connections
The Oscillator can operate in three different modes, each optimized for a specific frequency
range. The operating mode is selected by the fuses CKSEL3..1 as shown in Table 9-3 on page
28.
Note: This option should not be used with crystals, only with ceramic resonators.
The CKSEL0 Fuse together with the SUT1..0 Fuses select the start-up times as shown in Table
9-4 on page 28.
Table 9-3. Crystal Oscillator Operating Modes
CKSEL3:1
Frequency Range
(MHz)
Recommended Range for Capacitors C1
and C2 for Use with Crystals (pF)
100
(Note:)
0.4 - 0.9 –
101 0.9 - 3.0 12 - 22
110 3.0 - 8.0 12 - 22
111 8.0 - 12 - 22
Table 9-4. Start-up Times for the Crystal Oscillator Clock Selection
CKSEL0 SUT1:0
Start-up Time from
Power-down and
Power-save
Additional Delay
from Reset
(V
CC
= 5.0V)
Recommended
Usage
000 258 CK
(1)
14CK + 4.1ms Ceramic resonator,
fast rising power
001 258 CK
(1)
14CK + 65ms Ceramic resonator,
slowly rising power
010 1K CK
(2)
14CK Ceramic resonator,
BOD enabled
XTAL2
XTAL1
GND
C2
C1