Datasheet

4
2549PS–AVR–10/2012
ATmega640/1280/1281/2560/2561
Figure 1-3. Pinout ATmega1281/2561
Note: The large center pad underneath the QFN/MLF package is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
(RXD0/PCINT8/PDI) PE0
(TXD0/PDO) PE1
(XCK0/AIN0) PE2
(OC3A/AIN1) PE3
(OC3B/INT4) PE4
(OC3C/INT5) PE5
(T3/INT6) PE6
(ICP3/CLKO/INT7) PE7
(SS/PCINT0) PB0
(OC0B) PG5
(SCK/ PCINT1) PB1
(MOSI/ PCINT2) PB2
(MISO/ PCINT3) PB3
(OC2A/ PCINT4) PB4
(OC1A/PCINT5) PB5
(OC1B/PCINT6) PB6
(OC0A/OC1C/
PCINT7
) PB7
(TOSC2) PG3
(TOSC1) PG4
RESET
VCC
GND
XTAL2
XTAL1
(SCL/INT0) PD0
(SDA/INT1) PD1
(RXD1/INT2) PD2
(TXD1/INT3) PD3
(ICP1) PD4
(XCK1) PD5
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PG2 (ALE)
PC7 (A15)
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PG1 (RD)
PG0 (WR)
AVCC
GND
AREF
PF0 (ADC0)
PF1 (ADC1)
PF2 (ADC2)
PF3 (ADC3)
PF4 (ADC4/TCK)
PF5 (ADC5/TMS)
PF6 (ADC6/TDO)
PF7 (ADC7/TDI)
GND
VCC
PA0 (AD0)
PA1 (AD1)
PA2 (AD2)
(T1) PD6
(T0) PD7
INDEX CORNER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32