Datasheet

37. Packaging Information
37.1 32-pin 32A
Note:
Note: For the most current package drawings, see the Microchip Packaging Specification located at http://
www.microchip.com/packaging
TITLE
DRAWING NO.
REV.
32A, 32-lead, 7 x 7mm body size, 1.0mm body thickness,
0.8mm lead pitch, thin profile plastic quad flat package (TQFP)
C
32A
2010-10-20
PIN 1 IDENTIFIER
0°~7°
PIN 1
L
C
A1
A2 A
D1
D
e
E1 E
B
Notes:
1. This package conforms to JEDEC reference MS-026, Variation ABA.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10mm maximum.
A – – 1.20
A1 0.05 – 0.15
A2 0.95 1.00 1.05
D 8.75 9.00 9.25
D1 6.90 7.00 7.10 Note 2
E 8.75 9.00 9.25
E1 6.90 7.00 7.10 Note 2
B 0.30 – 0.45
C 0.09 – 0.20
L 0.45 – 0.75
e 0.80 TYP
COMMON DIMENSIONS
(Unit of measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
ATmega48PA/88PA/168PA
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40002011A-page 481