Datasheet

37.3 32-pin 32CC1
Note:
For the most current package drawings, see the Microchip Packaging Specification located at http://
www.microchip.com/packaging
TITLE
DRAWING NO.GPC
REV.
Package Drawing Contact:
[e-mail]
B
CAG
32CC1, 32-ball (6 x 6 Array), 4 x 4 x 0.6 mm
package, ball pitch 0.50 mm, Ultra Thin,
Fine-Pitch Ball Grid Array (UFBGA)
32CC1
07/06/10
b1
COMMON DIMENSIONS
(Unit of Measure = mm)
1 2 3 4 5 6
B
A
C
D
E
F
E
D
e
32-Øb
E
D
B
A
Pin#1 ID
0.08
A1
A
D1
E1
A2
A1 BALL CORNER
1 2 3 4 5 6
F
C
SIDE VIEW
BOTTOM VIEW
TOP VIEW
SYMBOL
MIN
NOM
MAX
NOTE
Note1:
Dimension “b” is measured at the maximum ball dia. in a plane parallel
to the seating plane.
Note2:
Dimension “b1” is the solderable surface def ned by the opening of the
solder resist layer.
e
A – – 0.60
A1 0.12 – –
A2 0.38 REF
b 0.25 0.30 0.35 1
b1 0.25 – – 2
D 3.90 4.00 4.10
D1 2.50 BSC
E 3.90 4.00 4.10
E1 2.50 BSC
e 0.50 BSC
37.4 28-pin 28M1
Note:
ATmega48PA/88PA/168PA
Packaging Information
© 2018 Microchip Technology Inc.
Datasheet Complete
DS40002011A-page 483