Datasheet

2
8019KS–AVR–11/10
ATmega165P
1. Pin Configurations
Figure 1-1. Pinout ATmega165P
Note: The large center pad underneath the QFN/MLF packages is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
1.1 Disclaimer
Typical values contained in this datasheet are based on simulations and characterization of
other AVR microcontrollers manufactured on the same process technology. Min and Max values
will be available after the device is characterized.
64 63 62
47
46
48
45
44
43
42
41
40
39
38
37
36
35
33
34
2
3
1
4
5
6
7
8
9
10
11
12
13
14
16
15
17
61 60
18
59
20
58
19 21
57
22
56
23
55
24
54
25
53
26
52
27
51
29 28
50 49
32 31 30
PC0
VCC GND PF0 (ADC0) PF7 (ADC7/TDI) PF1 (ADC1) PF2 (ADC2) PF3 (ADC3) PF4 (ADC4/TCK) PF5 (ADC5/TMS) PF6 (ADC6/TDO) AREF GND AVCC
(RXD/PCINT0) PE0
(TXD/PCINT1) PE1
DNC
(XCK/AIN0/PCINT2) PE2
(AIN1/PCINT3) PE3
(USCK/SCL/PCINT4) PE4
(DI/SDA/PCINT5) PE5
(DO/PCINT6) PE6
(CLKO/PCINT7) PE7
(SS/PCINT8) PB0
(SCK/PCINT9) PB1
(MOSI/PCINT10) PB2
(MISO/PCINT11) PB3
(OC0A/PCINT12) PB4
(OC2A/PCINT15) PB7
(T1) PG3
(OC1B/PCINT14) PB6
(T0) PG4
(OC1A/PCINT13) PB5
PC1
PG0
PD7
PC2
PC3
PC4
PC5
PC6
PC7
PA7
PG2
PA6
PA5
PA4
PA3
PA0 PA1 PA2
PG1
PD6
PD5
PD4 PD3 PD2
(INT0) PD1
(ICP1) PD0
(TOSC1) XTAL1 (TOSC2) XTAL2
RESET/PG5
GND
VCC
INDEX CORNER