Datasheet

19
5193F–SEEPR–1/08
AT93C46D
8Y6 – MLP 2x3
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
Dual No Lead Package (DFN) ,(MLP 2x3)
D
8Y6
10/16/07
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3. Soldering the large thermal pad i
s optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied to ground
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 2.00 BSC
E 3.00 BSC
D2 1.40 1.50 1.60
E2 - - 1.40
A - - 0.60
A1 0.0 0.02 0.05
A2 - - 0.55
A3 0.20 REF
L 0.20 0.30 0.40
e 0.50 BSC
b 0.20 0.25 0.30 2
A2A2
b
(8X)
(8X)
Pin 1 IDPin 1 ID
Pin 1Pin 1
IndexIndex
AreaArea
A1A1
A3A3
D
E
A
L (8X)L (8X)
e (6X)e (6X)
1.50 REF.1.50 REF.
D2D2
E2E2