Datasheet

18
5193F–SEEPR–1/08
AT93C46D
8U3-1 – dBGA2
R
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
PO8U3-1 B
DRAWING NO.
REV.
COMMON DIMENSIONS
(Unit of Measure - mm)
SYMBOL
MIN
NOM
MAX NOTE
A 0.73 0.79 0.85
A1 0.09 0.14 0.19
A2 0.40 0.45 0.50
b 0.20 0.25 0.30 2
D 1.50 BSC
E 2.0 BSC
e 0.50 BSC
e1 0.25 REF
d 1.00 BSC
d1 0.25 REF
5/3/05
b
D
E
A
A
2
A
1
8 SOLDER BALLS
1.
This drawing is for general information only.
2.
Dimension 'b' is measured at maximum solder ball diameter.
Bottem View
Side View
4
5
31
e
2
67
8
d
Top View
(e1)
(d1)
1.
PIN 1 BALL PAD CORNER
PIN 1 BALL PAD CORNER