Datasheet

11
5193F–SEEPR–1/08
AT93C46D
Notes: 1. “-B” denotes bulk
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, and dBGA2 = 5K per reel.
3. Available in tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
Please contact Serial Interface Marketing.
4. AT93C46D Ordering Information
Ordering Code Voltage Package Operation Range
AT93C46D-PU (Bulk form only) 1.8 8P3
Lead-free/Halogen-free/
Industrial Temperature
(−40°C to 85°C)
AT93C46DN-SH-B
(1)
(NiPdAu Lead finish) 1.8 8S1
AT93C46DN-SH-T
(2)
(NiPdAu Lead finish) 1.8 8S1
AT93C46D-TH-B
(1)
(NiPdAu Lead finish) 1.8 8A2
AT93C46D-TH-T
(2)
(NiPdAu Lead finish) 1.8 8A2
AT93C46DY6-YH-T
(2)
(NiPdAu Lead finish) 1.8 8Y6
AT93C46DU3-UU-T
(2)
1.8 8U3-1
AT93C46D-W-11
(3)
1.8 Die Sale
Industrial
(−40°C to 85°C)
Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)
8U3-1 8-ball, Die Ball Grid Array Package (dBGA2)
8Y6 8-lead, 2.00 mm x 3.00 mm Body, 0.50mm Pitch, Ultra-Thin Mini-MAO, Dual No Lead Package. (DFN), (MLP 2x3mm)
Options
−1.8 Low Voltage (1.8V to 5.5V)