Datasheet

1098
SAM9X25 [DATASHEET]
11054E–ATARM–10-Mar-2014
46.7.1 32 kHz Crystal Characteristics
46.7.2 XIN32 Clock Characteristics
Note: 1. These characteristics apply only when the 32.768 kHz Oscillator is in bypass mode (i.e., when RCEN = 0,
OSC32EN = 0, OSCSEL = 1 and OSC32BYP = 1) in the Slow Clock Controller Configuration Register (SCKC_CR).
See “Slow Clock Selection” in the PMC section.
46.8 32 kHz RC Oscillator Characteristics
Table 46-12. 32 kHz Crystal Characteristics
Symbol Parameter Conditions Min Typ Max Unit
ESR Equivalent Series Resistor Rs Crystal @ 32.768 kHz 50 100 kΩ
C
M
Motional Capacitance Crystal @ 32.768 kHz 0.6 3 fF
C
S
Shunt Capacitance Crystal @ 32.768 kHz 0.6 2 pF
I
DD ON
Current Dissipation
R
S
= 50 kΩ
(1)
C
CRYSTAL32
= 6 pF 0.55 1.3 µA
R
S
= 50 kΩ
(1)
C
CRYSTAL32
= 12.5pF 0.85 1.6 µA
R
S
= 100 kΩ
(1)
C
CRYSTAL32
= 6 pF 0.7 2.0 µA
R
S
= 100 kΩ
(1)
C
CRYSTAL32
= 12.5 pF 1.1 2.2 µA
I
DD STDBY
Standby Consumption 0.3 µA
Table 46-13. XIN32 Clock Characteristics
Symbol Parameter Conditions Min Max Unit
1/(t
CPXIN32
) XIN32 Clock Frequency 44 kHz
t
CPXIN32
XIN32 Clock Period 22 µs
t
CHXIN32
XIN32 Clock High Half-period 11 µs
t
CLXIN32
XIN32 Clock Low Half-period 11 µs
t
CLCH32
XIN32 Clock Rise time 400 ns
t
CLCL32
XIN32 Clock Fall time 400 ns
C
IN32
XIN32 Input Capacitance
(1)
6pF
R
IN32
XIN32 Pulldown Resistor
(1)
4MΩ
V
IN32
XIN32 Voltage
(1)
V
DDBU
V
DDBU
V
V
INIL32
XIN32 Input Low-Level Voltage
(1)
-0.3 0.3 × V
DDBU
V
V
INIH32
XIN32 Input High-Level Voltage
(1)
0.7 × V
DDBU
V
DDBU
+ 0.3 V
Table 46-14. 32 kHz RC Oscillator Characteristics
Symbol Parameter Conditions Min Typ Max Unit
1/(t
CPRCz
) Crystal Oscillator Frequency 20 32 44 kHz
Duty Cycle 45 55 %
t
ST
Startup Time 75 µs
I
DD ON
Power Consumption Oscillation After startup time 1.1 2.1 µA
I
DD STDBY
Standby Consumption 0.4 µA