Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsDev KitsPCB design board

1071

Table Of Contents

Description
1. Features
2. Block Diagram
3. Signal Description
4. Package and Pinout
- 4.1 Mechanical Overview of the 217-ball BGA Package
- 4.2 Mechanical Overview of the 247-ball BGA Package
- 4.3 217-ball BGA Package Pinout
- 4.4 247-ball BGA Package Pinout
5. Power Considerations
- 5.1 Power Supplies
6. Memories
- 6.1 Memory Mapping
- 6.2 Embedded Memories
  - 6.2.1 Internal SRAM
  - 6.2.2 Internal ROM
- 6.3 External Memories Overview
7. System Controller
- 7.1 System Controller Mapping
- 7.2 System Controller Block DIagram
- 7.3 Chip Identification
- 7.4 Backup Section
8. Peripherals
- 8.1 Peripheral Mapping
- 8.2 Peripheral Identifiers
- 8.3 Peripheral Interrupts and Clock Control
  - 8.3.1 System Interrupt
  - 8.3.2 External Interrupts
- 8.4 Peripheral Signal Multiplexing on I/O Lines
  - 8.4.1 Reset State
  - 8.4.2 PIO Line Selection
- 8.5 Fuse Box Features
  - 8.5.1 Read
  - 8.5.2 Write
9. ARM926EJ-S Processor Overview
- 9.1 Description
- 9.2 Embedded Characteristics
- 9.3 Block Diagram
- 9.4 ARM9EJ-S Processor
- 9.5 CP15 Coprocessor
  - 9.5.1 CP15 Registers Access
- 9.6 Memory Management Unit (MMU)
- 9.7 Caches and Write Buffer
  - 9.7.1 Instruction Cache (ICache)
  - 9.7.2 Data Cache (DCache) and Write Buffer
- 9.8 Bus Interface Unit
10. Debug and Test
- 10.1 Description
- 10.2 Embedded Characteristics
- 10.3 Block Diagram
- 10.4 Application Examples
  - 10.4.1 Debug Environment
  - 10.4.2 Test Environment
- 10.5 Debug and Test Pin Description
- 10.6 Functional Description
11. Advanced Interrupt Controller (AIC)
- 11.1 Description
- 11.2 Embedded Characteristics
- 11.3 Block Diagram
- 11.4 Application Block Diagram
- 11.5 AIC Detailed Block Diagram
- 11.6 I/O Line Description
- 11.7 Product Dependencies
- 11.8 Functional Description
- 11.9 Write Protection Registers
- 11.10 Advanced Interrupt Controller (AIC) User Interface
12. Boot Strategies
- 12.1 SAM9CN12 only
- 12.2 SAM9CN11 and SAM9N12 only
13. Boot Sequence Controller (BSC)
- 13.1 Description
- 13.2 Embedded Characteristics
- 13.3 Product Dependencies
- 13.4 Boot Sequence Controller (BSC) Registers User Interface
  - 13.4.1 Boot Sequence Configuration Register
14. Reset Controller (RSTC)
- 14.1 Description
- 14.2 Embedded Characteristics
- 14.3 Block Diagram
- 14.4 Functional Description
- 14.5 Reset Controller (RSTC) User Interface
15. Real-time Clock (RTC)
- 15.1 Description
- 15.2 Embedded Characteristics
- 15.3 Block Diagram
- 15.4 Product Dependencies
  - 15.4.1 Power Management
  - 15.4.2 Interrupt
- 15.5 Functional Description
- 15.6 Real-time Clock (RTC) User Interface
16. Periodic Interval Timer (PIT)
- 16.1 Description
- 16.2 Embedded Characteristics
- 16.3 Block Diagram
- 16.4 Functional Description
- 16.5 Periodic Interval Timer (PIT) User Interface
17. Watchdog Timer (WDT)
- 17.1 Description
- 17.2 Embedded Characteristics
- 17.3 Block Diagram
- 17.4 Functional Description
- 17.5 Watchdog Timer (WDT) User Interface
18. Shutdown Controller (SHDWC)
- 18.1 Description
- 18.2 Embedded Characteristics
- 18.3 Block Diagram
- 18.4 I/O Lines Description
- 18.5 Product Dependencies
  - 18.5.1 Power Management
- 18.6 Functional Description
- 18.7 Shutdown Controller (SHDWC) User Interface
19. General-Purpose Backup Registers (GPBR)
- 19.1 Description
- 19.2 Embedded Characteristics
- 19.3 General Purpose Backup Registers (GPBR) User Interface
  - 19.3.1 General Purpose Backup Register x
20. Slow Clock Controller (SCKC)
- 20.1 Description
- 20.2 Embedded Characteristics
- 20.3 Block Diagram
- 20.4 Slow Clock Controller (SCKC) User Interface
  - 20.4.1 Slow Clock Configuration Register
21. Clock Generator
- 21.1 Description
- 21.2 Embedded Characteristics
- 21.3 Block Diagram
- 21.4 Slow Clock Selection
- 21.5 Main Clock
- 21.6 Divider and PLL Block
  - 21.6.1 Divider and Phase Lock Loop Programming
22. Power Management Controller (PMC)
- 22.1 Description
- 22.2 Embedded Characteristics
- 22.3 Block Diagram
- 22.4 Master Clock Controller
- 22.5 Processor Clock Controller
- 22.6 USB Device and Host Clocks
- 22.7 LP-DDR/DDR2 Clock
- 22.8 Peripheral Clock Controller
- 22.9 Programmable Clock Output Controller
- 22.10 Programming Sequence
- 22.11 Clock Switching Details
  - 22.11.1 Master Clock Switching Timings
  - 22.11.2 Clock Switching Waveforms
- 22.12 Power Management Controller (PMC) User Interface
23. Parallel Input/Output Controller (PIO)
- 23.1 Description
- 23.2 Embedded Characteristics
- 23.3 Block Diagram
- 23.4 Product Dependencies
- 23.5 Functional Description
- 23.6 I/O Lines Programming Example
- 23.7 Parallel Input/Output Controller (PIO) User Interface
24. Debug Unit (DBGU)
- 24.1 Description
- 24.2 Embedded Characteristics
- 24.3 Block Diagram
- 24.4 Product Dependencies
- 24.5 UART Operations
- 24.6 Debug Unit (DBGU) User Interface
25. Fuse Controller (FUSE)
- 25.1 Description
- 25.2 Embedded Characteristics
- 25.3 Block Diagram
- 25.4 Functional Description
- 25.5 Fuse Controller (FUSE) User Interface
26. Bus Matrix (MATRIX)
- 26.1 Description
- 26.2 Embedded Characteristics
- 26.3 Matrix Masters
- 26.4 Matrix Slaves
- 26.5 Master to Slave Access
- 26.6 Memory Mapping
- 26.7 Special Bus Granting Mechanism
- 26.8 Arbitration
  - 26.8.1 Arbitration Scheduling
    - 26.8.1.1 Undefined Length Burst Arbitration
    - 26.8.1.2 Slot Cycle Limit Arbitration
  - 26.8.2 Arbitration Priority Scheme
    - 26.8.2.1 Fixed Priority Arbitration
    - 26.8.2.2 Round-Robin Arbitration
- 26.9 Write Protect Registers
- 26.10 Bus Matrix (MATRIX) User Interface
27. External Bus Interface (EBI)
- 27.1 Description
- 27.2 Embedded Characteristics
- 27.3 EBI Block Diagram
- 27.4 I/O Lines Description
- 27.5 Application Example
  - 27.5.1 Hardware Interface
  - 27.5.2 Connection Examples
- 27.6 Product Dependencies
  - 27.6.1 I/O Lines
- 27.7 Functional Description
- 27.8 Implementation Examples
28. Programmable Multibit ECC Controller (PMECC)
- 28.1 Description
- 28.2 Embedded Characteristics
- 28.3 Block Diagram
- 28.4 Functional Description
  - 28.4.1 MLC/SLC Write Page Operation using PMECC
    - 28.4.1.1 SLC/MLC Write Operation with Spare Enable Bit Set
    - 28.4.1.2 MLC/SLC Write Operation with Spare Area Disabled
  - 28.4.2 MLC/SLC Read Page Operation using PMECC
- 28.5 Software Implementation
- 28.6 Programmable Multibit ECC Controller (PMECC) User Interface
29. Programmable Multibit ECC Error Location Controller (PMERRLOC)
- 29.1 Description
- 29.2 Embedded Characteristics
- 29.3 Block Diagram
- 29.4 Functional Description
- 29.5 Programmable Multibit ECC Error Location (PMERRLOC) User Interface
30. Static Memory Controller (SMC)
- 30.1 Description
- 30.2 Embedded Characteristics
- 30.3 I/O Lines Description
- 30.4 Multiplexed Signals
- 30.5 Application Example
  - 30.5.1 Hardware Interface
- 30.6 Product Dependencies
  - 30.6.1 I/O Lines
- 30.7 External Memory Mapping
- 30.8 Connection to External Devices
  - 30.8.1 Data Bus Width
  - 30.8.2 Byte Write or Byte Select Access
- 30.9 Standard Read and Write Protocols
- 30.10 Automatic Wait States
- 30.11 Data Float Wait States
- 30.12 External Wait
- 30.13 Slow Clock Mode
  - 30.13.1 Slow Clock Mode Waveforms
  - 30.13.2 Switching from (to) Slow Clock Mode to (from) Normal Mode
- 30.14 Asynchronous Page Mode
- 30.15 Programmable IO Delays
- 30.16 Static Memory Controller (SMC) User Interface
31. DDR SDR SDRAM Controller (DDRSDRC)
- 31.1 Description
- 31.2 Embedded Characteristics
- 31.3 DDRSDRC Module Diagram
- 31.4 Initialization Sequence
- 31.5 Functional Description
- 31.6 Software Interface/SDRAM Organization, Address Mapping
- 31.7 DDR SDR SDRAM Controller (DDRSDRC) User Interface
32. DMA Controller (DMAC)
- 32.1 Description
- 32.2 Embedded Characteristics
- 32.3 DMA Controller Peripheral Connections
- 32.4 Block Diagram
- 32.5 Functional Description
- 32.6 DMAC Software Requirements
- 32.7 Write Protection Registers
- 32.8 DMA Controller (DMAC) User Interface
33. USB Device Port (UDP)
- 33.1 Description
- 33.2 Embedded Characteristics
- 33.3 Block Diagram
  - 33.3.1 Signal Description
- 33.4 Product Dependencies
- 33.5 Typical Connection
  - 33.5.1 USB Device Transceiver
  - 33.5.2 VBUS Monitoring
- 33.6 Functional Description
- 33.7 USB Device Port (UDP) User Interface
34. USB Host Port (UHP)
- 34.1 Description
- 34.2 Embedded Characteristics
- 34.3 Block Diagram
- 34.4 Product Dependencies
- 34.5 Functional Description
  - 34.5.1 Host Controller Interface
  - 34.5.2 Host Controller Driver
- 34.6 Typical Connection
35. High Speed MultiMedia Card Interface (HSMCI)
- 35.1 Description
- 35.2 Embedded Characteristics
- 35.3 Block Diagram
- 35.4 Application Block Diagram
- 35.5 Pin Name List
- 35.6 Product Dependencies
- 35.7 Bus Topology
- 35.8 High Speed MultiMedia Card Operations
- 35.9 SD/SDIO Card Operation
  - 35.9.1 SDIO Data Transfer Type
  - 35.9.2 SDIO Interrupts
- 35.10 CE-ATA Operation
- 35.11 HSMCI Boot Operation Mode
  - 35.11.1 Boot Procedure, Processor Mode
  - 35.11.2 Boot Procedure DMA Mode
- 35.12 HSMCI Transfer Done Timings
- 35.13 Register Write Protection
- 35.14 High Speed MultiMedia Card Interface (HSMCI) User Interface
36. Serial Peripheral Interface (SPI)
- 36.1 Description
- 36.2 Embedded Characteristics
- 36.3 Block Diagram
- 36.4 Application Block Diagram
- 36.5 Signal Description
- 36.6 Product Dependencies
- 36.7 Functional Description
- 36.8 Serial Peripheral Interface (SPI) User Interface
37. Timer Counter (TC)
- 37.1 Description
- 37.2 Embedded Characteristics
- 37.3 Block Diagram
- 37.4 Pin Name List
- 37.5 Product Dependencies
- 37.6 Functional Description
- 37.7 Timer Counter (TC) User Interface
38. Pulse Width Modulation Controller (PWM)
- 38.1 Description
- 38.2 Embedded characteristics
- 38.3 Block Diagram
- 38.4 I/O Lines Description
- 38.5 Product Dependencies
- 38.6 Functional Description
- 38.7 Pulse Width Modulation Controller (PWM) User Interface
39. Two-wire Interface (TWI)
- 39.1 Description
- 39.2 Embedded Characteristics
- 39.3 List of Abbreviations
- 39.4 Block Diagram
- 39.5 Application Block Diagram
  - 39.5.1 I/O Lines Description
- 39.6 Product Dependencies
- 39.7 Functional Description
  - 39.7.1 Transfer Format
  - 39.7.2 Modes of Operation
- 39.8 Master Mode
- 39.9 Multi-master Mode
  - 39.9.1 Definition
  - 39.9.2 Different Multi-master Modes
    - 39.9.2.1 TWI as Master Only
    - 39.9.2.2 TWI as Master or Slave
- 39.10 Slave Mode
- 39.11 Write Protection System
- 39.12 Two-wire Interface (TWI) User Interface
40. Universal Synchronous Asynchronous Receiver Transceiver (USART)
- 40.1 Description
- 40.2 Embedded Characteristics
- 40.3 Block Diagram
- 40.4 Application Block Diagram
- 40.5 I/O Lines Description
- 40.6 Product Dependencies
- 40.7 Functional Description
- 40.8 Universal Synchronous Asynchronous Receiver Transmitter (USART) User Interface
41. Universal Asynchronous Receiver Transmitter (UART)
- 41.1 Description
- 41.2 Embedded Characteristics
- 41.3 Block Diagram
- 41.4 Product Dependencies
- 41.5 UART Operations
- 41.6 Universal Asynchronous Receiver Transmitter (UART) User Interface
42. Analog-to-Digital Converter (ADC)
- 42.1 Description
- 42.2 Embedded Characteristics
- 42.3 Block Diagram
- 42.4 Signal Description
- 42.5 Product Dependencies
- 42.6 Functional Description
- 42.7 Touchscreen
- 42.8 Analog-to-Digital Converter (ADC) User Interface
43. Synchronous Serial Controller (SSC)
- 43.1 Description
- 43.2 Embedded Characteristics
- 43.3 Block Diagram
- 43.4 Application Block Diagram
- 43.5 Pin Name List
- 43.6 Product Dependencies
- 43.7 Functional Description
- 43.8 SSC Application Examples
  - 43.8.1 Write Protection Registers
- 43.9 Synchronous Serial Controller (SSC) User Interface
44. LCD Controller (LCDC)
- 44.1 Description
- 44.2 Embedded Characteristics
- 44.3 Block Diagram
- 44.4 I/O Lines Description
- 44.5 Product Dependencies
- 44.6 Functional Description
- 44.7 LCD Controller (LCDC) User Interface
45. Advanced Encryption Standard (AES)
- 45.1 Description
- 45.2 Embedded Characteristics
- 45.3 Product Dependencies
  - 45.3.1 Power Management
  - 45.3.2 Interrupt
- 45.4 Functional Description
- 45.5 Security Features
  - 45.5.1 Unspecified Register Access Detection
- 45.6 Advanced Encryption Standard (AES) User Interface
46. Secure Hash Algorithm (SHA)
- 46.1 Description
- 46.2 Embedded Characteristics
- 46.3 Product Dependencies
  - 46.3.1 Power Management
  - 46.3.2 Interrupt
- 46.4 Functional Description
- 46.5 Secure Hash Algorithm (SHA) User Interface
47. True Random Number Generator (TRNG)
- 47.1 Description
- 47.2 Embedded Characteristics
- 47.3 Block Diagram
- 47.4 Product Dependencies
  - 47.4.1 Power Management
  - 47.4.2 Interrupt
- 47.5 Functional Description
- 47.6 True Random Number Generator (TRNG) User Interface
48. Electrical Characteristics
- 48.1 Absolute Maximum Ratings
- 48.2 DC Characteristics
- 48.3 Power Consumption
  - 48.3.1 Power Consumption versus Modes
- 48.4 Clock Characteristics
- 48.5 12 MHz RC Oscillator Characteristics
- 48.6 32 kHz Oscillator Characteristics
  - 48.6.1 32 kHz Crystal Characteristics
  - 48.6.2 XIN32 Clock Characteristics
- 48.7 32 kHz RC Oscillator Characteristics
- 48.8 PLL Characteristics
- 48.9 I/Os
- 48.10 Analog-to-Digital Converter (ADC)
- 48.11 USB Transceiver Characteristics
  - 48.11.1 Electrical Characteristics
- 48.12 Core Power Supply POR Characteristics
  - 48.12.1 Power Sequence Requirements
  - 48.12.2 Power-Up Sequence
- 48.13 SMC Timings
  - 48.13.1 Timing Conditions
  - 48.13.2 Timing Extraction
- 48.14 DDRSDRC Timings
- 48.15 Peripheral Timings
49. Mechanical Overview of the 217-ball and 247-ball BGA Packages
- 49.1 217-ball BGA Package
- 49.2 247-ball BGA Package
- 49.3 Marking
50. SAM9N12/SAM9CN11/SAM9CN12 Ordering Information
51. SAM9N/CN Series Errata
- 51.1 SAM9N12/CN11/CN12 Errata
- 51.2 SAM9CN12 Errata: Revision A
  - 51.2.1 BootROM
    - 51.2.1.1 Boot from SPI Serial Flash Devices (xx25xxx) Is not Working
  - 51.2.2 16 MHz Main Crystal
    - 51.2.2.1 16 MHz Main Crystal Detection
- 51.3 SAM9CN12 Errata: Revision B
  - 51.3.1 Boot ROM
    - 51.3.1.1 Boot from SPI Data/Serial Flash Devices do not work with All Memories
Revision History
Table of Contents

1073

SAM9N12/SAM9CN11/SAM9CN12 [DATASHEET]

11063K–ATARM–05-Nov-13

Table 49-2. Soldering Information

Ball Land 0.43 mm +/- 0.05

Solder Mask Opening 0.30 mm +/- 0.05

Table 49-3. Device and 217-ball BGA Package Maximum Weight

450 mg

Table 49-4. 217-ball BGA Package Characteristics

Moisture Sensitivity Level 3

Table 49-5. Package Reference

JEDEC Drawing Reference MO-205

JESD97 Classification e1