Datasheet

1139
SAM9G25 [DATASHEET]
11032D–ATARM–10-Mar-2014
47.2.2 247-ball VFBGA package
Figure 47-3. 247-ball VFBGA Package Drawing
Table 47-11. Package Information
BGA Substrate Ball Land 0.25 mm +/- 0.05
Solder Mask Opening 0.275 mm +/- 0.05
Table 47-12. Device and 247-ball BGA Package Maximum Weight
177 mg
Table 47-13. 247-ball BGA Package Characteristics
Moisture Sensitivity Level 3
Table 47-14. Package Reference
JEDEC Drawing Reference none
JESD97 Classification e8
Table 47-10. Ball Information
Ball Pitch 0.5 mm +/- 0.05
Ball Diameter 0.3 mm +/- 0.05