Datasheet

1081
SAM9G25 [DATASHEET]
11032C–ATARM–25-Jan-13
47.3 Marking
All devices are marked with the Atmel logo and the ordering code.
Additional marking may be in one of the following formats:
where
z “YY”: manufactory year
z “WW”: manufactory week
z “V”: revision
z “XXXXXXXXX”: lot number
Table 47-10. Ball Information
Ball Pitch 0.5 mm +/- 0.05
Ball Diameter 0.3 mm +/- 0.05
Table 47-11. Package Information
BGA Substrate Ball Land 0.25 mm +/- 0.05
Solder Mask Opening 0.275 mm +/- 0.05
Table 47-12. Device and 247-ball BGA Package Maximum Weight
177 mg
Table 47-13. 247-ball BGA Package Characteristics
Moisture Sensitivity Level 3
Table 47-14. Package Reference
JEDEC Drawing Reference none
JESD97 Classification e8
YYWW V
XXXXXXXXX
ARM