Datasheet

29
SAM9G25 [DATASHEET]
11032BS–ATARM–09-Jul-13
Table 5-4. Ball Information
Ball Pitch 0.5 mm +/- 0.05
Ball Diameter 0.3 mm +/- 0.05
Table 5-5. Package Information
Ball Land 0.35 mm +/- 0.05
Solder Mask Opening 0.27 mm +/- 0.05
Table 5-6. Device and 247-ball BGA Package Maximum Weight
177 mg
Table 5-7. 247-ball BGA Package Characteristics
Moisture Sensitivity Level 3
Table 5-8. Package Reference
JEDEC Drawing Reference none
JESD97 Classification e1