Datasheet

41
SAM9260 [SUMMARY]
6221LS–ATARM–15-Oct-12
11.2 Soldering Profile
Table 11-8 gives the recommended soldering profile from J-STD-20.
Note: It is recommended to apply a soldering temperature higher than 250°C
A maximum of three reflow passes is allowed per component.
Table 11-5. Device and 208-lead PQFP Package Maximum Weight
5.5 g
Table 11-6. 208-lead PQFP Package Characteristics
Moisture Sensitivity Level 3
Table 11-7. Package Reference
JEDEC Drawing Reference MS-022
JESD97 Classification e3
Table 11-8. Soldering Profile
Profile Feature PQFP208 Green Package BGA217 Green Package
Average Ramp-up Rate (217°C to Peak) 3⋅ C/sec. max. 3⋅ C/sec. max.
Preheat Temperature 175°C ±25°C 180 sec. max. 180 sec. max.
Temperature Maintained Above 217°C 60 sec. to 150 sec. 60 sec. to 150 sec.
Time within 5⋅ C of Actual Peak Temperature 20 sec. to 40 sec. 20 sec. to 40 sec.
Peak Temperature Range 260 +0 ⋅ C 260 +0 ⋅ C
Ramp-down Rate 6⋅ C/sec. max. 6⋅ C/sec. max.
Time 25⋅ C to Peak Temperature 8 min. max. 8 min. max.