Datasheet

27
1745FS–ATARM–18-Apr-06
AT91M55800A Summary
Revision History
Doc. Rev Date Comments
Change
Request
Ref.
1745AS Jul-01 First issue
1745BS 29-Jan-02
pg. 14 Added information to section Internal Memories
pg. 19 Changed Table 7
pg. 21 Added Table 10
pg. 22 Added Table 11
pg. 23 Added section Soldering Profile
1745CS 18-Apr-02
pg. 3 Changed Table 2
pg. 8 Changed FIgure 3, Block Diagram.
pg. 9 Changed “Peripherals” paragraph.
pg. 10 Changed “User Peripherals” paragraph.
pg. 16 Changed “Peripheral Data Controller” paragraph.
pg. 17 Changed “AIC” paragraph.
pg. 18 Changed “DAC” paragraph
pg. 19 Changed Table 7
1745DS 14-Jun-05
Global
New corporate format numbering
package reference TQFP changed to LQFP
pg. 25 added 10.1 ”Green Package Soldering Profile”
05-330pg. 25 added 10.2 ”BGA Soldering Profile (RoHS-compliant)”
pg. 26 new package info inserted in 11. ”Ordering Information”
1745ES 03-Oct-05
Global
Change in format introduced Chapter numbering with change to table and
figure numbering.
1745D
page 14
Section 7.4.2 ”NTRST Pin” info added
Figure 7-1, “Separate or Common Reset Management,” added to chapter
05-452
1745FS 18-Apr-06
page 25
page 26
10. ”Soldering Profile” Standard Soldering Profile section errased
11. ”Ordering Information”
AT91M55800A-33AI LQFP176 Sn/Pb package removed
AT91M55800A-33CI BGA 176 Sn/Pb package removed
#2602