Datasheet

24
1745FS–ATARM–18-Apr-06
AT91M55800A Summary
Figure 9-2. 176-ball Ball Grid Array Package Drawing
Table 9-4. Device and 176-ball BGA Package Maximum Weight
606 mg
Notes: 1. Package dimensions conform to
JEDEC MO-205
2. Dimensioning and tolerancing per
ASME Y14.5M-1994
3. All dimensions in mm
4. Solder Ball position designation
per JESD 95-1, SPP-010
5. Primary datum Z and seating
plane are defined by the spherical
crowns of the solder balls
Symbol Maximum
aaa 0.1
bbb 0.1
ddd 0.1
eee 0.03
fff 0.04
ggg 0.03
hhh 0.1
kkk 0.1
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