Datasheet

4
7593LS–AVR–09/12
AT90USB64/128
Figure 1-2. Pinout Atmel AT90USB64/128-QFN.
Note: The large center pad underneath the MLF packages is made of metal and internally connected to
GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center
pad is left unconnected, the package might loosen from the board.
2
3
1
4
5
6
7
8
9
10
11
12
13
14
16 33
15
47
46
48
45
44
43
42
41
40
39
38
37
36
35
34
17 18
20
19 21 22 23 24 25 26 27 29
28
32 31 30
52 51 50 49 64 63 62 53 61 60
59
58 57
56
55 54
AT90USB128/64
(64-lead QFN top view)
INDEX CORNER
AVCC
GND
AREF
PF0 (ADC0)
PF1 (ADC1)
PF2 (ADC2)
PF3 (ADC3)
PF4 (ADC4/TCK)
PF5 (ADC5/TMS)
PF6 (ADC6/TDO)
PF7 (ADC7/TDI)
GND
VCC
PA0 (AD0)
PA1 (AD1)
PA2 (AD2)
(INT.7/AIN.1/UVcon) PE7
UVcc
D-
D+
UGnd
UCap
VBus
(IUID) PE3
(SS/PCINT0) PB0
(INT.6/AIN.0) PE6
(PCINT1/SCLK) PB1
(PDI/PCINT2/MOSI) PB2
(PDO/PCINT3/MISO) PB3
(PCINT4/OC.2A) PB4
(PCINT5/OC.1A) PB5
(PCINT6/OC.1B) PB6
(PCINT7/OC.0A/OC.1C) PB7
(INT4/TOSC1) PE4
(INT.5/TOSC2) PE5
VCC
GND
XTAL2
XTAL1
(OC0B/SCL/INT0) PD0
(OC2B/SDA/INT1) PD1
(RXD1/INT2) PD2
(TXD1/INT3) PD3
(ICP1) PD4
(XCK1) PD5
(T1) PD6
(T0) PD7
RESET
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PE2 (ALE/HWB)
PC7 (A15/IC.3/CLKO)
PC6 (A14/OC.3A)
PC5 (A13/OC.3B)
PC4 (A12/OC.3C)
PC3 (A11/T.3)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PE1 (RD)
PE0 (WR)