Datasheet
121
AT89C51AC3
4383D–8051–02/08
Electrical Characteristics
Absolute Maximum Ratings
DC Parameters for Standard Voltage
T
A
= -40°C to +85°C; V
SS
= 0V;
V
CC
=2.7V to 5.5V and F = 0 to 40 MHz (both internal and external code execution)
V
CC
=4.5V to 5.5V and F = 0 to 60 MHz (internal code execution only)
Ambiant Temperature Under Bias:
I = industrial ....................................................... -40°C to 85°C
Storage Temperature .................................... -65°C to + 150°C
Voltage on V
CC
from V
SS
......................................-0.5V to + 6V
Voltage on Any Pin from V
SS
..................... -0.5V to V
CC
+ 0.2V
Power Dissipation .............................................................. 1 W
Table 71. DC Parameters in Standard Voltage
Symbol Parameter Min Typ
(5)
Max Unit Test Conditions
V
IL
Input Low Voltage -0.5 0.2Vcc - 0.1 V
V
IH
Input High Voltage except XTAL1, RST 0.2 V
CC
+ 0.9 V
CC
+ 0.5 V
V
IH1
Input High Voltage, XTAL1, RST 0.7 V
CC
V
CC
+ 0.5 V
V
OL
Output Low Voltage, ports 1, 2, 3 and 4
(6)
0.3
0.45
1.0
V
V
V
I
OL
= 100
µ
A
(4)
I
OL
= 1.6 mA
(4)
I
OL
= 3.5 mA
(4)
V
OL1
Output Low Voltage, port 0, ALE, PSEN
(6)
0.3
0.45
1.0
V
V
V
I
OL
= 200
µ
A
(4)
I
OL
= 3.2 mA
(4)
I
OL
= 7.0 mA
(4)
V
OH
Output High Voltage, ports 1, 2, 3, and 4
V
CC
- 0.3
V
CC
- 0.7
V
CC
- 1.5
V
V
V
I
OH
= -10
µ
A
I
OH
= -30
µ
A
I
OH
= -60
µ
A
V
CC
= 3V to 5.5V
V
OH1
Output High Voltage, port 0, ALE, PSEN
V
CC
- 0.3
V
CC
- 0.7
V
CC
- 1.5
V
V
V
I
OH
= -200
µ
A
I
OH
= -3.2 mA
I
OH
= -7.0 mA
V
CC
= 5V
±
10%
R
RST
RST Pulldown Resistor 50 100 200 k
Ω
I
IL
Logical 0 Input Current ports 1, 2, 3 and 4 -50
µ
A Vin = 0.45V
I
LI
Input Leakage Current
±
10
µ
A 0.45V < Vin < V
CC
I
TL
Logical 1 to 0 Transition Current, ports 1, 2, 3
and 4
-650
µ
A Vin = 2.0V
C
IO
Capacitance of I/O Buffer 10 pF
Fc = 1 MHz
T
A
= 25
°
C
I
PD
Power-down Current 75 150
µ
A 3V < V
CC
< 5.5V
(3)
Note: Stresses at or above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device
at these or any other conditions above those indicated in
the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions may affect
device reliability.
The power dissipation is based on the maximum allowable
die temperature and the thermal resistance of the package.