Datasheet

75
32099IS–01/2012
AT32UC3L016/32/64
Figure 8-2. QFN-48 Package Drawing
Note: The exposed pad is not connected to anything internally, but should be soldered to ground to increase board level reliability.
Table 8-5. Device and Package Maximum Weight
140 mg
Table 8-6. Package Characteristics
Moisture Sensitivity Level MSL3
Table 8-7. Package Reference
JEDEC Drawing Reference M0-220
JESD97 Classification E3