Datasheet

43
AT30TSE004A [DATASHEET]
Atmel-8868C-DTS-AT30TSE004A-Datasheet_122013
12.2 8MAA — 8-pad WDFN
DRAWING NO. REV. TITLE
GPC
8MAA A
09/11/12
8MAA, 8-pad 2.0 x 3.0mm Body, 0.50mm Pitch
Very, Very Thin Dual No Lead Package
(WDFN) (Sawn)
YRV
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.70 0.75 0.80
A1 0.00 0.02 0.05
A2 0.45 0.55 0.65
A3 2.0 REF
D 1.90 2.00 2.10
D2 1.20 - 1.60
E 2.90 3.00 3.10
E2 1.20 - 1.60
b 0.18 0.25 0.30 2
L 0.30 – 0.45
e 0.50 BSC
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Package Drawing Contact:
[e-mail]
Notes: 1. This drawing is for general information only. Refer to JEDEC
Drawing MO-229, WCED-3, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured
between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal,
the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended.
No electrical connection is accomplished to the device through
this pad, so if soldered it should be tied to ground
A2
b
(8X)
Pin 1 ID
Pin 1
Index
Area
A1
A3
D
E
A
L (8X)
e (6X)
1.50 REF.
D2
E2