Datasheet
Table Of Contents
- Features
- Temperature Sensor Features
- Serial EEPROM Features
- Table of Contents
- 1. Description
- 2. Pin Descriptions and Pinouts
- 3. Block Diagram
- 4. Device Communication
- 5. Device Addressing
- 6. Temperature Sensor
- 6.1 Functional Description
- 6.2 Register Descriptions
- 6.2.1 Pointer Register (8-bit Write Only, Address = N/A)
- 6.2.2 Capability Register (16-bit Read-only, Address = 00h)
- 6.2.3 Configuration Register (16-bit Read/Write, Address = 01h)
- 6.2.4 Upper Limit Register (16-bit Read/Write, Address = 02h)
- 6.2.5 Lower Limit Register (16-bit Read/Write, Address = 03h)
- 6.2.6 Critical Alarm Register (16-bit Read/Write, Address = 04h)
- 6.2.7 Temperature Register (16-bit Read-only, Address = 05h)
- 6.2.8 Manufacturer ID Register (16-bit Read-only, Address = 06h)
- 6.2.9 Device ID Register (16-bit Read-only, Address = 07h)
- 6.3 Temperature Sensor Write Operations
- 6.4 Temperature Sensor Read Operations
- 7. Serial EEPROM
- 8. Electrical Specifications
- 9. Ordering Code Detail
- 10. Ordering Information
- 11. Part Markings
- 12. Package Drawings
- 13. Revision History
AT30TSE004A [DATASHEET]
Atmel-8868C-DTS-AT30TSE004A-Datasheet_122013
42
12. Package Drawings
12.1 8MA2 — 8-pad UDFN
TITLE
DRAWING NO.
GPC
REV.
Package Drawing Contact:
packagedrawings@atmel.com
8MA2YNZ C
8MA2, 8-pad, 2 x 3 x 0.6 mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No
Lead Package (UDFN)
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D 1.90 2.00 2.10
E 2.90 3.00 3.10
D2 1.40 1.50 1.60
E2 1.20 1.30 1.40
A 0.50 0.55 0.60
A1 0.0 0.02 0.05
A2 – – 0.55
C 0.152 REF
L 0.30 0.35 0.40
e 0.50 BSC
b 0.18 0.25 0.30 3
K 0.20 – –
9/6/12
D2
E2
E
e (6x)
L (8x)
b (8x)
Pin#1 ID
A
A1
A2
Pin 1 ID
D
C
K
8
7
6
5
1
2
3
4
1
2
3
4
8
7
6
5